TLP2662(TP1,F)

TLP2662,TLP2662F Photocouplers GaAAs Infrared LED & Photo IC TLP2662,TLP2662FTLP2662,TLP2662FTLP2662,TLP2662FTLP2662,TLP2662F 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Factory Automation (FA) High-Speed Digital Interfacing for Instrumentation and Control Devices Measuring Instruments 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2662/TLP2662F consists of high-intensity GaAAs infrared light-emitting diodes (LEDs) optically coupled to a high-gain, high-speed photoreceptor chip. The TLP2662/TLP2662F guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. It is offered in the DIP8 package. With two LED-photoreceptor pairs, the TLP2662/ TLP2662F helps save board space. An internal noise shield provides superior common-mode rejection for improved noise immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: DIP8 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 10 MBd (typ.) (NRZ) (6) Threshold input current: 5.0 mA (max) (7) Supply current: 8 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 2015 Toshiba Corporation 2015-11-30 1 Rev.5.0TLP2662,TLP2662F 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP2662 TLP2662(LF1) TLP2662(LF5) 11-10C405S 11-10C4S 11-10C401S TLP2662F TLP2662F(LF4) 11-10C404S 11-10C402S Note: Lead-formed product: (LF1), (LF4), (LF5) 5. 5. Pin AssignmentPin Assignment 5. 5. Pin AssignmentPin Assignment 1: Anode 1 2: Cathode 1 3: Cathode 2 4: Anode 2 5: GND 6: V (Output 2) O2 7: V (Output 1) O1 8: V CC 2015 Toshiba Corporation 2015-11-30 2 Rev.5.0