TLP152(TPL,E

TLP152 Photocouplers GaAAs Infrared LED & Photo IC TLP152TLP152TLP152TLP152 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Plasma Display Panels (PDPs) Industrial Inverters MOSFET Gate Drivers IGBT Gate Drivers 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP152 is a photocoupler in an SO6 package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. The photodetector IC chip has an internal shield to provide a high common-mode transient immunity of 20 kV/ s and thus superior noise immunity between the input and output pins. The TLP152 has a totem-pole output that can both sink and source current. It is suitable for directly driving a small IGBT or power MOSFET. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 100 (4) Supply current: 3.0 mA (max) (5) Supply voltage: 10 to 30 V (6) Threshold input current: 7.5 mA (max) (7) Propagation delay time: t = 190 ns (max), t = 170 ns (max) pHL pLH (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)(Note 1)(Note 1) (Note 1) : EN62368-1 (Pending) (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). Start of commercial production 2012-06 2016-2017 2017-12-19 1 Toshiba Electronic Devices & Storage Corporation Rev.6.0TLP152 4. 4. 4. 4. Packaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin Assignment 1: Anode 3: Cathode 4: GND 5: V O 6: V CC 11-4L1S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Size Unit Creepage distances 5.0 (min) mm Clearance distances 5.0 (min) Internal isolation thickness 0.4 (min) 2016-2017 2017-12-19 2 Toshiba Electronic Devices & Storage Corporation Rev.6.0