Product Information

TLGE68CG(F)

TLGE68CG(F) electronic component of Toshiba

Datasheet
LED Uni-Color Green 574nm 2-Pin

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

50: USD 4.7691 ea
Line Total: USD 238.46

0 - Global Stock
MOQ: 50  Multiples: 50
Pack Size: 50
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 50
Multiples : 50

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TLGE68CG(F)
Toshiba

50 : USD 4.7691
100 : USD 4.561
200 : USD 4.2315
500 : USD 3.8153
1000 : USD 3.7286

     
Manufacturer
Product Category
Forward Current
Forward Voltage
Luminous Intensity
Lens Dimensions
Deleted
Operating Temperature Classification
High Brightness
Shape Type
Type
Chip Material
Main Category
Number Of Elements
Product Depth Mm
Product Length Mm
Emitting Color
Dominant Wave Length
Power Dissipation
Peak Wavelength
Reverse Voltage
Rad Hardened
Product Height Mm
Mounting
Operating Temp Range
Pin Count
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TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F) TOSHIBA InGaAP LED TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F) LED Lamps for mounting on through-hole PCB using Unit: mm an automatic insertion machine 3mm package wide viewing angle Can be mounted on a PCB using an automatic insertion machine (please refer to mounting Precautions Using an Automatic Insertion Machine) InGaAP Emitted colors: red, yellow and green Colored, Transparent lens Applications: Various types of information panels, indicators for amusement equipment and panel backlighting illumination sources Lineup Product Name Color Material JEDEC TLRME68CG(F) Red JEITA TLYE68CG(F) Yellow InGaA lP TOSHIBA 4-3U1 TLGE68CG(F) Green TLFGE68CG(F) Green Weight: 0.15 g(Typ.) Absolute Maximum Ratings (Ta = 25C) Operating Storage Forward Current Reverse Voltage Power Dissipation Temperature Temperature Product Name I (mA) V (V) P (mW) F R D T (C) Tstg (C) opr TLRME68CG(F) 50 4 120 TLYE68CG(F) 50 4 120 40~100 40~120 TLGE68CG(F) 50 4 120 TLFGE68CG(F) 50 4 120 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2007-10-01 TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F) Electrical and Optical Characteristics (Ta = 25C) Luminous Intensity Forward Voltage Reverse Current Typ. Emission Wavelength I V I V F R Product Name I Min Typ. I Typ. Max I Max V d P F F F R TLRME68CG(F) 626 (636) 23 20 85 260 20 1.9 2.4 20 50 4 TLYE68CG(F) 587 (590) 17 20 85 300 20 2.0 2.4 20 50 4 TLGE68CG(F) 571 (574) 17 20 47.6 110 20 2.0 2.4 20 50 4 TLFGE68CG(F) 565 (568) 15 20 27.2 70 20 2.0 2.4 20 50 4 Unit nm mA mcd mA V mA A V Precautions These LED lamps made of InGaAlP will also emit some IR light. If a photodetector is located near an LED lamp, please ensure that it will not be affected by this IR light. Manual soldering should be performed within 3 s at a maximum temperature of 300C or 5 s at a maximum temperature of 260C. When forming the leads, bend each lead without applying any forming stress. Soldering must be performed after the leads have been formed. Mounting Precautions Using an Automatic Insertion Machine (1) These newly designed LED lamps are intended for mounting on both through-hole PCBs by means of an automatic mounting machine. Compared to conventional 3-mm LED lamps, they are less prone to the effects of stress during automatic mounting (such as mechanical stress within the package resin transmitted via the leads). This reduced mechanical stress results in a lower incidence of damage to the package resin and lower emission failure rates. If one of these lamps is subjected to excessive stress, however, the resin part may break or the lamp may be damaged in such a way that it will not emit light. Please take the following precautions when mounting these devices. Toshiba recommends the use of a 0.9-mm PCB hole diameter. However, this recommendation is subject to the type of automatic mounting machine used, the board material and the way in which the board material has been processed. Please evaluate the mounting process carefully before actually using the automatic mounting machine to mount these LED lamps. The use of PCB holes with a diameter larger than 0.9 mm may result in increased stress when soldering is performed (depending on the lead cutting shape and the clinching method), and devices may easily be malfunction. The insertion pressure and clinching angle must both be minimized so as to minimize the lead-cutting stress and clinch stress applied to the LED lamps. Soldering Conditions Preheating Soldering Flow Temperature 120~150C No more than 260C Time Within 60 seconds Within 5 seconds (2) Precautions when using Panasert radial-Taping automatic mounting machine: Two-lead LED lamps are suitable for mounting using an anvil due to its movable-blade structure. When using three-lead type, please take the following precautions. Synchronize the strokes of the two movable blades to one another as closely as possible. Adjust the timings of the movable blades so as to minimize the difference between them. In addition, do not set the anvil in such a way that the anvils center blade will pull the leads, as this will result in excessive mechanical stress to the LED lamps, which might damage them. Avoid any blade which is defective or which shows signs of excessive wear. * For using other than Panasert, please refer to the specifications for the automatic mounting machine which is to be used. 2 2007-10-01

Tariff Desc

8541.40.00 54 No .Light emitting diodes (LED), LED displays, optocouplers, photosensitive transistors and diodes, infra-red and fibre optic emitters and detectors Free

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES (LED); MOUNTED PIEZO-ELECTRIC CRYSTALS:
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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