Application Specification DIPLOMATE* Dual Leaf (DL) Low-Profile 114-1049 DIP Sockets 28 OCT 11 Rev A All numerical values are in metric units with U.S. customary units in brackets . Dimensions are in millimeters and inches . NOTE Unless otherwise specified, dimensions have a tolerance of 0.13 .005 and angles have a tolerance of 2. Figures and illustrations are for identification only and are not drawn to scale. i 1. INTRODUCTION This specification covers the requirements for application of DIPLOMATE DL low-profile DIP sockets. The socket consists of a housing and solder contacts. The housing features a polarization indicator, which indicates circuit cavity No. 1. The socket is available in 6 through 64 positions. The sockets are designed for manual or automatic application to a printed circuit (pc) board. When corresponding with personnel, use the terminology provided in this specification to facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1. Housing Circuit Cavity No. 1 Contact Solder Tail Polarization Indicator Figure 1 2. REFERENCE MATERIAL 2.1. Revision Summary Changed to this application specification include: Changed company name and logo Updated application specification to corporate requirements Replaced part number and product code in Paragraph 2.2 2.2. Customer Assistance Reference Product Base Part Number 382568 and Product Code 1541 are representative of DIPLOMATE DL low-profile DIP sockets. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Representative or, after purchase, by calling PRODUCT INFORMATION at the number at the bottom of this page. 2011 Tyco Electronics Corporation, a TE Connectivity Ltd. Company TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. 1 of 4 All Rights Reserved PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, *Trademark visit our website at www.te.com LOC B TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of their respective owners. 114-1049 2.3. Drawings Customer Drawings for product part numbers are available from the service network. If there is a conflict between the information contained in the Customer Drawings and this specification or with any other technical documentation supplied, the information contained in the Customer Drawings takes priority. 2.4. Specifications Product Specification 108-1066 provides product performance and test information. 2.5. Instructional Material Instruction Sheets (408-series) provide product assembly instructions or tooling setup and operation procedures and Customer Manuals (409-series) provide machine setup and operating procedures. There are no documents available that pertain to this product. 2.6. Manuals Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and characteristics with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 3. REQUIREMENTS 3.1. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the socket material. B. Shelf Life The sockets should remain in the shipping containers until ready for use to prevent deformation to the contacts. The sockets should be used on a first in, first out basis to avoid storage contamination that could adversely affect performance. 3.2. PC Board A. Thickness The recommended maximum pc board thickness is 2.36 .093 . B. Layout The pc board layout must be designed using the dimensions given in Figure 2. 3.3. Soldering A. Process Manual 402-40 provides guidelines for soldering process. B. Flux Selection Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. C. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. D. Drying When drying cleaned assemblies and pc boards, the temperature limitation must not be exceeded: 105C 221F and 85C 185F for copper alloy contact material. Excessive temperatures may cause housing degradation and/or plating deterioration. Rev A 2 of 4