Product Information

NTCG164BH472JT1

NTCG164BH472JT1 electronic component of TDK

Datasheet
NTC (Negative Temperature Coefficient) Thermistors 4.7K OHM 5%

Manufacturer: TDK
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

480: USD 0.1601 ea
Line Total: USD 76.85

46307 - Global Stock
Ships to you between
Mon. 06 May to Fri. 10 May
MOQ: 480  Multiples: 1
Pack Size: 1
Availability Price Quantity
46307 - Global Stock


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 480
Multiples : 1
480 : USD 0.1601
8000 : USD 0.0654
27000 : USD 0.0621
68000 : USD 0.0604
215000 : USD 0.0573

2240 - Global Stock


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 0.1552
10 : USD 0.1334
100 : USD 0.0943
500 : USD 0.0805
1000 : USD 0.0701
4000 : USD 0.0667
8000 : USD 0.0575
48000 : USD 0.0575

     
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(1/13) Conformity to RoHS Directive NTC Thermistors NTCG Series(SMD, Pb Free) NTCG06/10/16/20 Types NTC(Negative Temperature Coefficient) Thermistors are manufac- tured from sintered metal oxides. Each thermistor consists of a combination of two to four of the following materials: Manganese, Nickel, Cobalt and Copper. NTC thermistors are semiconductor resistors that exhibit decreasing resistance characteristics with increasing temperature. TDK thermistors have low thermal time constants which result in extremely high rates of resistance change to accurately track the temperature. CHARACTERISTICS OF THE NTC THERMISTOR Y-axis: Linear Y-axis: Log. 1000 200 180 160 100 140 120 10 100 80 60 1 40 20 0.1 0 50 0 50 100 150 50 0 50 100 150 Temperature(C) ( ) Temperature C FEATURES APPLICATIONS Small sized 0603 type (L0.6 W0.3 T0.3mm) series are avail- Temperature sensor Temperature compensation able. Lead (Pb) free product. By using lead-less terminal electrodes and electroplating (Ni- USED SET Sn), this product realized excellent solderablity and soldering Equipment related to mobile communication heat resistance, comparing with the conventional eutectic TCXOs (temperature compensated type quartz oscillator), RF mixture solder and lead-free solder (Sn/Ag/Cu, etc.). circuits (power amp circuits, temperature monitoring circuits), Product Conforming to RoHS Directive LCD panel temperature compensation circuits, battery pack Conformity to RoHS Directive: This means that, in conformity temperature compensation circuits with EU Directive 2002/95/EC, lead, cadmium, mercury, Computer related equipment hexavalent chromium, and specific bromine-based flame CPU periphery temperature monitoring circuits, temperature retardants, PBB and PBDE, have not been used, except for compensation circuit of optical pickup for DVD writing, tempera- exempted applications. ture compensated circuit in HDD Good solderability. DVC/DSC devices Layered internal electrode structure. Auto-focus circuits, plunger peripheral circuits, battery pack tem- Product series provides a wide range of resistances and B perature control circuits constants. Equipment related to car audio Good stability of resistance value after soldering. Various types of pickup temperature compensation circuits, tem- The 0603, 1608 and 1005 types provide 3 different shapes with perature compensation for various types of circuits identical resistance-temperature characteristics. Optical communication related equipment Attains less that low floating capacitance (using TCXO) in the Laser transmission circuit temperature compensation high frequency region. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. All specifications are subject to change without notice. 009-02 / 20070301 / eb221 ntcg.fm ( ) Resistance k ( ) Resistance k(2/13) SHAPES AND DIMENSIONS STRUCTURAL DIAGRAM L Sn Pd NTC Ni Ag B Electrode material Internal:Pd External:Ag/Ni/Sn Dimensions in mm Type L W T B 0603 0.60.03 0.30.03 0.30.03 0.1 min. 1005 10.05 0.50.05 0.50.05 0.1 min. 1608 1.60.1 0.80.1 0.80.1 0.2 min. 2012 20.2 1.250.2 0.70.2 0.2 min. RECOMMENDED PC BOARD PATTERN RECOMMENDED REFLOW SOLDERING CONDITIONS a 250 200 150 100 50 2 2 T a T W b W 3 3 Over 60s Over 60s 20s max. All specifications are subject to change without notice. 009-02 / 20070301 / eb221 ntcg.fm T W b T W ( ) Temperature C T 200C /0.5s

Tariff Desc

8541.50.00 - Other semiconductor devices
42 No Other discrete (not IC) semiconductor devices
(PTC resettable fuses used to protect against overcurrent. Also known as a multifuse or polyfuse or polyswitch)

8536.10 FUSES AND FUSE HOLDERS, subminiature, plug in or pigtail type known as picofuses or microfuses, dimensions NOT exceeding 6mm x 18mm TC 8530773
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EPO
InvenSense
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Micronas GmbH
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TDK ELECTRONICS
TDK INNOVETA
TDK InvenSense
TDK LAMBDA
TDK SEMICONDUCTOR
TDK-Lambda Americas Inc
TDK-Lambda Americas Inc.
TDK-Lambda Americas Inc. [CI] (VA)
TDK-Micronas
tronics
Tronics / TDK

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