Datasheet T4076 0A V7
DATASHEET
DATE: 30-Jul-19
(Preliminary Data)
TDKS PRODUCT NAME
MMICT4076-0A-908
TDK Corporation
Sales Engineering
Electronic Components Sales & TDK Electronics AG
Marketing Group TEG MEMS
Sales Manager Engineering Superior Engineering
Sales
Manager Person in Charge
A. Leidl H. Hayashi M. Winter
Features:
TDK SiMic MEMS Microphone
Surface Mounted Technology (SMT)
Reflow soldering up to 260 C
RoHS compatible, Ni/Au-plated terminals suited for lead free soldering
2
Small size of 2.75 1.85 mm
Very low height of typically 0.9 mm
Approximate weight of 20 mg
Sound hole on bottom side
High long-term temperature stability
High signal to noise ratio
Excellent protection against EMI
Positive polarity; sound pressure increase will increase output voltage
Applications:
Microphone designed for mobile phones, headsets, PDAs, notebooks and cameras
Rev. Date Revised by Revision
1 Oct-9 2017 A. Schober Initial issue
2 Feb-1-2018 A. Schober Electrical specification updated
Electrical and Mechanical specification updated, chapter 8
3 Mar-27-2018 A. Schober
updated
Electrical specification updated to reflect current sample
4 Aug-14-2018 A. Schober
performance
5 Oct-19-2018 A. Schober PN updated
Electrical and Mechanical specification and product marking
6 Jan-10-2019 A. Schober
updated
7 Jul-30-2019 A. Schober Chapter 4 and 5 updated, chapter 7 added
NAME DRAWING No. DATE REV. PAGE
DATASHEET T4076_0A 30-Jul-19 7 2 / 13
TDK CORPORATION
TDK Technology Proprietary and Confidential Information of TDK Group Companies