Product Information

ITG-3200

ITG-3200 electronic component of TDK

Datasheet
IC, GYRO, TRI-AXIS, +/-2000 DEG/S, 24QFN
Manufacturer: TDK
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 17.0832 ea
Line Total: USD 17.08

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 09 May to Wed. 15 May

MOQ : 1
Multiples : 1
1 : USD 17.0832
10 : USD 14.3678
100 : USD 13.8439

Read More Specifications

     
Manufacturer
Product Category
Brand
Mems Sensor Output
Measurement Axis
Full Scale Rate Range
Supply Voltage Min
Supply Voltage Max
Sensor Case Style
No. Of Pins
Sensitivity Typ
Rohs Phthalates Compliant
Msl
Svhc
Operating Temperature Max
Operating Temperature Min
Operating Temperature Range
Supply Voltage Range
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Additional Infomation About Product

InvenSense Inc. Document Number: PS-ITG-3200A-00-01.4 1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A. Revision: 1.4 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Release Date: 03/30/2010 Website: www.invensense.com ITG-3200 Product Specification Revision 1.4 Document Number: PS-ITG-3200A-00-01.4 Revision: 1.4 ITG-3200 Product Specification Release Date: 03/30/2010 CONTENTS 1 DOCUMENT INFORMATION .............................................................................................................................. 4 1.1 REVISION HISTORY ............................................................................................................................................. 4 1.2 PURPOSE AND SCOPE ........................................................................................................................................... 5 1.3 PRODUCT OVERVIEW .......................................................................................................................................... 5 1.4 APPLICATIONS ..................................................................................................................................................... 5 2 FEATURES ............................................................................................................................................................... 6 3 ELECTRICAL CHARACTERISTICS .................................................................................................................. 7 3.1 SENSOR SPECIFICATIONS ..................................................................................................................................... 7 3.2 ELECTRICAL SPECIFICATIONS .............................................................................................................................. 8 3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ......................................................................................................... 9 3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................10 2 3.5 I C TIMING CHARACTERIZATION........................................................................................................................11 3.6 ABSOLUTE MAXIMUM RATINGS .........................................................................................................................12 4 APPLICATIONS INFORMATION ......................................................................................................................13 4.1 PIN OUT AND SIGNAL DESCRIPTION ...................................................................................................................13 4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................................14 4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ...........................................................................................14 4.4 RECOMMENDED POWER-ON PROCEDURE ...........................................................................................................15 5 FUNCTIONAL OVERVIEW .................................................................................................................................16 5.1 BLOCK DIAGRAM ...............................................................................................................................................16 5.2 OVERVIEW .........................................................................................................................................................16 5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..........................................16 2 5.4 I C SERIAL COMMUNICATIONS INTERFACE ........................................................................................................17 5.5 CLOCKING ..........................................................................................................................................................17 5.6 SENSOR DATA REGISTERS ..................................................................................................................................17 5.7 INTERRUPTS .......................................................................................................................................................17 5.8 DIGITAL-OUTPUT TEMPERATURE SENSOR .........................................................................................................17 5.9 BIAS AND LDO ...................................................................................................................................................17 5.10 CHARGE PUMP ...................................................................................................................................................17 6 DIGITAL INTERFACE .........................................................................................................................................18 2 6.1 I C SERIAL INTERFACE .......................................................................................................................................18 7 REGISTER MAP ....................................................................................................................................................22 8 REGISTER DESCRIPTION ..................................................................................................................................23 8.1 REGISTER 0 WHO AM I ....................................................................................................................................23 8.2 REGISTER 21 SAMPLE RATE DIVIDER ..............................................................................................................23 8.3 REGISTER 22 DLPF, FULL SCALE ....................................................................................................................24 8.4 REGISTER 23 INTERRUPT CONFIGURATION ......................................................................................................26 8.5 REGISTER 26 INTERRUPT STATUS ....................................................................................................................26 8.6 REGISTERS 27 TO 34 SENSOR REGISTERS.........................................................................................................27 8.7 REGISTER 62 POWER MANAGEMENT ...............................................................................................................27 9 ASSEMBLY .............................................................................................................................................................29 9.1 ORIENTATION .....................................................................................................................................................29 9.2 PACKAGE DIMENSIONS .......................................................................................................................................30 9.3 PACKAGE MARKING SPECIFICATION ..................................................................................................................31 9.4 TAPE & REEL SPECIFICATION .............................................................................................................................31 2 of 39

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

8543.70.00 - Other machines and apparatus Free
13 Signal processors (graphic equalisers, crossovers etc.)
91 Other

9027.10.00 Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes.

9031.80.00 - MEASURING OR CHECKING INSTRUMENTS, APPLIANCES AND MACHINES, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER; PROFILE PROJECTORS Other instruments, appliances and machines Free"

TDK may also be referenced as

EP9
EPC
EPCOS
EPCOS TDK
EPCOS (TDK)
EPCOS / TDK
EPCOS Inc
EPCOS/TDK
EPO
InvenSense
Micronas
Micronas GmbH
TD4
TDK Corporation
TDK ELECTRONICS
TDK INNOVETA
TDK InvenSense
TDK LAMBDA
TDK SEMICONDUCTOR
TDK-Lambda Americas Inc
TDK-Lambda Americas Inc.
TDK-Lambda Americas Inc. [CI] (VA)
TDK-Micronas
tronics
Tronics / TDK

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