Product Information

BAL-CW1250D3

BAL-CW1250D3 electronic component of STMicroelectronics

Datasheet
Signal Conditioning Balun Int Harmonic Filter 50 Ohm 24dBm

Manufacturer: STMicroelectronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.7205 ea
Line Total: USD 0.72

1152 - Global Stock
Ships to you between
Fri. 24 May to Thu. 30 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
712 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

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BAL-CW1250D3
STMicroelectronics

1 : USD 0.7318
10 : USD 0.7311
25 : USD 0.7304
50 : USD 0.7298
100 : USD 0.729
250 : USD 0.7284
500 : USD 0.7277

1152 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

BAL-CW1250D3
STMicroelectronics

1 : USD 0.7205
10 : USD 0.6997
25 : USD 0.4636
50 : USD 0.4087
100 : USD 0.3704
250 : USD 0.329
500 : USD 0.3188
1000 : USD 0.2281

712 - WHS 3


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 218
Multiples : 1

Stock Image

BAL-CW1250D3
STMicroelectronics

218 : USD 0.7357

     
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BAL-CW1250D3 50 nominal input / conjugate match balun to CW1250/CW1260/CW1150/CW1160, with integrated harmonic filter Description STMicroelectronics BAL-CW1250D3 is a balun (balanced/unbalanced device) designed to transform a single ended signal to differential signals in WLAN application. This BAL-CW1250D3, with low insertion losses in the bandwidth 2400 MHz to 2500 MHz, has been customized for CW1250, CW1150, CW1260, CW1160 transceiver. The differential output embeds an integrated matching network adapted Lead-free Flip-Chip package 5 bumps to the transceiver. The BAL-CW1250D3 has been designed using STMicroelectronics IPD (integrated passive Datasheet production data device) technology on non-conductive glass substrate to optimize RF performance. Features Figure 1. Pinout diagram (top view) 50 nominal input / match ST-Ericsson RF IC CW1250, CW1150, CW1260, CW1160 3 2 1 Low insertion loss Low amplitude imbalance GND SE A Low phase imbalance VCC DC blocking access on single RF input B 2 Small footprint: < 1.2 mm DIFF DIFF C Benefits Extremely low profile (< 550 m after reflow) Integrate matching network High RF performance RF components count and area reduction Applications Balun with integrated matching for ST-Ericsson RF IC CW1250, C1150, CW1260 September 2015 DocID024678 Rev 2 1/10 This is information on a product in full production. www.st.com 10Characteristics BAL-CW1250D3 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min Typ Max P Average power RF 24 dBm IN IN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 k, air discharge) 2000 ESD ratings charged device model V 500 V ESD (JESD22-C101-D) ESD ratings machine model 200 (MM: C = 200 pF, R = 25 , L = 500 nH) T Operating temperature -30 to +85 C OP Table 2. Impedances (T = 25 C) amb Value Symbol Parameter Unit Min Typ Max Z Nominal differential output impedance matched OUT Z Nominal input impedance 50 IN Table 3. RF performance (T = 25 C) amb Value Symbol Parameter Unit Min Typ Max F Frequency range (bandwidth) 2400 2500 MHz IL Insertion loss in bandwidth 0.97 dB RL Single ended return loss in bandwidth -21 dB SE RL Differential return loss in bandwidth -24 dB DIFF imb Phase imbalance -10 10 Aimb Amplitude imbalance -1 0.1 1 dB Att 2nd harmonic attenuation -19 dB 2f0 2/10 DocID024678 Rev 2

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
C-Max
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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