Product Information

ETRX357

ETRX357 electronic component of Silicon Labs

Datasheet
Zigbee Modules - 802.15.4 Telegesis ETRX357 Zigbee Radio Module, Chip Antenna, R309
Manufacturer: Silicon Labs
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 32.637 ea
Line Total: USD 32.64

5947 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
5947 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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ETRX357
Silicon Labs

1 : USD 32.637
10 : USD 30.107
25 : USD 27.6115
50 : USD 27.5655
100 : USD 25.4955
250 : USD 24.2305
600 : USD 22.1835
1200 : USD 22.1605
2400 : USD 22.08

Read More Specifications

     
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RoHS - XON
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Supply Current Transmitting
Supply Current Receiving
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Additional Infomation About Product

Telegesis TG-ETRX35X-PM-010-121 ETRX351 and ETRX357 Product Manual 1.21 ETRX35x ZIGBEE MODULES PRODUCT MANUAL 2019 Silicon Labs ETRX35x Product Manual Not Recommended for New Designs ETRX351 and ETRX357 Table of Contents 1 INTRODUCTION ................................................................................................................. 5 1.1 Hardware Description ....................................................................................................... 5 2 PRODUCT APPROVALS ........................................................................................................ 6 2.1 FCC Approvals ................................................................................................................. 6 FCC Labelling Requirements ........................................................................................... 7 2.2 IC (Industry Canada) Approvals............................................................................................ 7 2.3 European Certification (ETSI) ........................................................................................... 8 2.4 ICASA Approvals .............................................................................................................. 8 2.5 Australia and New Zealand (C-Tick) ................................................................................. 8 2.6 Brazil ................................................................................................................................ 9 2.7 Declarations of Conformity ............................................................................................... 9 2.8 IEEE 802.15.4 .................................................................................................................. 9 2.9 The Zigbee Protocol ....................................................................................................... 10 3 MODULE PINOUT ................................................................................................................. 11 4 HARDWARE DESCRIPTION ............................................................................................ 13 4.1 Hardware Interface ......................................................................................................... 13 5 FIRMWARE DESCRIPTION .............................................................................................. 14 5.1 Token Settings ............................................................................................................... 15 5.2 Custom Firmware ........................................................................................................... 15 5.3 Software Interface .......................................................................................................... 16 6 ABSOLUTE MAXIMUM RATINGS ................................................................................. 17 6.1 Environmental Characteristics ........................................................................................ 17 6.2 Recommended Operating Conditions ............................................................................. 17 7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ........................................................................................ 20 9 A/D CONVERTER CHARACTERISTICS ........................................................................ 21 10 AC ELECTRICAL CHARACTERISTICS ......................................................................... 21 10.1 TX Power Characteristics ............................................................................................... 23 11 PHYSICAL DIMENSIONS ................................................................................................. 25 12 RECOMMENDED SOLDERING TEMPERATURE PROFILE ............................................ 27 13 PRODUCT LABEL DRAWING .......................................................................................... 28 14 RECOMMENDED FOOTPRINT ........................................................................................ 29 14.1 Pad dimensions .............................................................................................................. 29 14.2 Recommended Placement.................................................................................................. 30 14.3 Example carrier board .................................................................................................... 32 15 RELIABILITY TESTS ............................................................................................................ 33 16 APPLICATION NOTES .................................................................................................. 33 16.1 Safety Precautions ......................................................................................................... 33 16.2 Design Engineering Notes .................................................................................................. 33 2019 Silicon Labs - 2 - ETRX35x Product Manual (Rev 1.21) Not Recommended for New Designs

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

Silicon Labs may also be referenced as

BLUEGIGA
Bluegiga Technologies
Energy Micro
Redpine
Redpine Signals
REDPINE SIGNALS INC.
Redpine Signals, Inc.
RPS
Silicon
SILICON LABORATORIES
Silicon Laboratories Inc
SILICON LABS
Silicon Labs Bluegiga
Silicon Labs / Bluegiga
SL4
Telegesis
TELEGESIS (UK) LIMITED
Touchstone
Touchstone Semiconductor
TOUCHSTONE TECH.
TOUCHSTONE TECHNOLOGY
Zentri / ACKme Networks

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