SKYPER 32 PRO R Absolute Maximum Ratings Symbol Conditions Values Unit V Supply voltage primary 16 V s V Input signal voltage (HIGH) Vs + 0.3 V iH V Input signal voltage (LOW) GND - 0.3 V iL Iout Output peak current 15 A PEAK Iout Output average current 50 mA AVmax f Max. switching frequency 50 kHz max Collector emitter voltage sense across SKYPER V 1700 V CE the IGBT Rate of rise and fall of voltage dv/dt 50 kV/s secondary to primary side IGBT Driver Core Isolation test voltage input - output (AC, V 4000 V isol IO rms, 2s) Partial discharge extinction voltage, SKYPER 32 PRO R V 1500 V isolPD rms, Q 10pC PD Preliminary Data Isolation test voltage output 1 - output 2 V 1500 V isol12 (AC, rms, 2s) Features R Minimum rating for external R 1.5 Gon Gon min Two output channels R Minimum rating for external R 1.5 Goff Goff min Integrated potential free power supply Q Max. rating for output charge per pulse 6.3 C Under voltage protection prim/sec out/pulse Drive interlock top / bottom T Operating temperature -40 ... 85 C op Dynamic short circuit protection T Storage temperature -40 ... 85 C stg Halt status with failure management External failure input (sec.) Characteristics Soft turn-off UL recognized, ROHS Symbol Conditions min. typ. max. Unit IEC 60068-1 (climate) 40/085/56, no condensation and no dripping water V Supply voltage primary side 14.4 15 15.6 V s permitted, non-corrosive, climate class 3K3 acc. EN60721 I Supply current primary (no load) 80 mA S0 Coated with varnish Supply current primary side (max.) 500 mA V Input signal voltage on / off 15 / 0 V i Typical Applications* V Input treshold voltage HIGH 12.3 V IT+ Driver for IGBT modules in bridge circuits in industrial application V input threshold voltage (LOW) 4.6 V IT- DC bus voltage up to 1200V Input resistance (switching/HALT R 100 k IN signal) Footnotes V Turn on output voltage 15 V G(on) with external high voltage diode V Turn off output voltage -7 V G(off) Please Note: the isolation test is not f Asic system switching frequency 8 MHz ASIC performed as a series test at SEMIKRON t Input-output turn-on propagation time 1.2 s and must be performed by the user d(on)IO accroding to VDE 0110-20 t Input-output turn-off propagation time 1.2 s d(off)IO t Error input-output propagation time 3.1 5.8 s d(err) Isolation coordination in compliance with t Error reset time 9 s EN50178 PD2 pERRRESET Operating temperature is real ambient t Top-Bot interlock dead time 0 4.3 s TD temperature around the driver core C Coupling capacitance prim sec 12 pF ps Degree of protection: IP00 wweight 34 g 6 MTBF 1.3 10 h This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. Driver Core by SEMIKRON Rev. 4 27.05.2014 1 SKYPER 32PRO R Technical Explanations Revision 04 Status: Prepared by: Johannes Krapp This Technical Explanation is valid for the following parts: Related Documents: part number: L6100202 title: Data Sheet SKYPER 32PRO R date code (YYWW): CW22 2014 SKYPER 32PRO R Content Application and Handling Instructions.............................................................................................................................................. 2 Further application support ............................................................................................................................................................... 2 General Description .......................................................................................................................................................................... 3 Features of SKYPER 32PRO ........................................................................................................................................................... 3 Block diagram.................................................................................................................................................................................... 4 Dimensions ........................................................................................................................................................................................ 4 PIN Array Primary Side.................................................................................................................................................................. 5 PIN Array Secondary Side ............................................................................................................................................................ 6 Driver Performance ........................................................................................................................................................................... 7 Insulation ........................................................................................................................................................................................... 7 Isolation Test Voltage ....................................................................................................................................................................... 8 Auxiliary Power Supply ..................................................................................................................................................................... 8 Under Voltage Reset (UVR) ............................................................................................................................................................. 9 Under Voltage Protection (UVP) primary......................................................................................................................................... 9 Under Voltage Protection secondary ............................................................................................................................................... 9 Input Signals...................................................................................................................................................................................... 9 Short Pulse Suppression (SPS) ..................................................................................................................................................... 10 Failure Management ....................................................................................................................................................................... 10 Halt Logic Signal (HLS) .................................................................................................................................................................. 11 Dead Time generation (Interlock TOP / BOT) adjustable (DT) .................................................................................................... 11 Dynamic Short Circuit Protection by V monitoring / de-saturation monitoring (DSCP) ........................................................ 12 CEsat Adjustment of DSCP ....................................................................................................................................................................... 13 High Voltage Diode for DSCP ........................................................................................................................................................ 14 Gate resistors .................................................................................................................................................................................. 14 Soft Turn-Off (STO) ........................................................................................................................................................................ 15 External Error Input (EEI) ............................................................................................................................................................... 15 Application Example ....................................................................................................................................................................... 16 Mounting Notes ............................................................................................................................................................................... 16 Environmental Conditions............................................................................................................................................................... 17 Marking ............................................................................................................................................................................................ 18 1 2014-05-27 Rev04 by SEMIKRON