The documentation and process conversion
measures necessary to comply with this document
[INCH-POUND
shall be completed by 5 September 2015.
MIL-PRF-19500/382K
5 June 2015
SUPERSEDING
MIL-PRF-19500/382J
18 April 2012
PERFORMANCE SPECIFICATION SHEET
* TRANSISTOR, PNP, SILICON, LOW-POWER,
ENCAPSULATED (THROUGH-HOLE AND SURFACE MOUNT), AND UNENCAPSULATED, RADIATION
HARDNESS ASSUARANCE, DEVICE TYPES 2N2944A, 2N2945A, 2N2946A,
QUALITY LEVELS: JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MILPRF19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for low-power, PNP, silicon 2N2944A,
2N2945A, 2N2946A transistors for use in high-speed, switching and general purpose amplifier applications. A M
and UBM suffix will indicate a matched pair. Four levels of product assurance are provided for each encapsulated
device type as specified in MILPRF19500, and two levels of product assurance are provided for each
unencapsulated device type. Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided
for quality levels JANTX, JANS, JANHC, and JANKC. RHA level designators M, D, P, L, R, F, G, and H
are appended to the device prefix to identify devices, which have passed RHA requirements.
* 1.2 Package and die outlines. The device package for the encapsulated device type are as follows: TO-46 in
accordance with figure 1 and surface mount in accordance with figure 2. The dimensions and topography for JANHC
and JANKC unencapsulated die are in accordance with figure 3.
1.3 Maximum ratings, unless otherwise specified T = +25C.
A
P P V V V V I T and R R
T T EBO CBO CEO ECO C J JA JSP
Types
T = +25C T = +25C T (3) (4)
STG
A SP
(1) (2) (1) (2)
mW mW V dc V dc V dc V dc mA dc
C C/W C/W
2N2944A 400 N/A -15 -15 -10 -10 -100 -65 to 435 N/A
2N2945A, AM 400 N/A -25 -25 -20 -20 -100 +200
435 N/A
2N2946A 400 N/A -40 -40 -35 -35 -100
435 N/A
2N2944AUB 400 800 -15 -15 -10 -10 -100 -65 to 435 (5) 90
2N2945AUB 400 800 -25 -25 -20 -20 -100 +200 435 (5) 90
2N2945AUBM 400 800 -25 -25 -20 -20 -100 435 (5) 90
2N2946AUB 400 800 -40 -40 -35 -35 -100 435 (5) 90
(1) For derating, see figures 4 and 5.
(2) See 3.3 for abbreviations.
(3) For thermal curves, see figures 6 and 7.
* Comments, suggestions, or questions on this document should be to DLA Land and Maritime, ATTN: VAC,
P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact information
can change, you may want to verify the currency of this address information using the ASSIST Online database
at MIL-PRF-19500/382K
1.3 Maximum ratings, unless otherwise specified T = +25C. - Continued.
A
(4) For non-thermal conductive PCB or unknown PCB surface mount conditions in free air, substitute figure 6 for the
UB package and use R .
JA
(5) T = +55C for UB on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1 - layer 1 Oz Cu, horizontal,
A
still air, pads (UB) = .034 inch (0.86 mm) x .048 inch (1.22 mm), R with a defined thermal resistance condition
JA
included is measured at P = 400 mW.
T
1.4 Primary electrical characteristics unless otherwise specified T = +25C.
A
Limits h h (inv) r (on)
FE1 FE 1 ec 2
V = -0.5 V dc V = -0.5 V dc I = -1 mA dc
CE EC B
I = -1 mA dc I = -200 A dc I = 100 A ac(rms)
C E e
I = 0; f = 1 kHz
E
2N2944A 2N2945 2N2946A 2N2944A 2N2945A 2N2946A 2N2944A 2N2945A
A, AM,
UB AUBM
ohms ohms
Min 100 70 70 50 50 30 20
Max 200 4 6
Limits r (on) V (ofs)
ec 2 EC
I = -1 mA dc
B
I = 100 A ac(rms)
e
I = 0; f = 1 kHz I = -200 A dc I = -1.0 mA dc
E B b
I = 0 I = 0
E E
2N2946A 2N2944A 2N2945A 2N2946A 2N2944A 2N2945A 2N2946A
ohms mV dc mV dc mV dc mV dc mV dc mV dc
Min
Max 8 -0.3 -0.5 -0.8 -0.6 -1.0 -2.0
Limits h C C
fe obo ibo
V = -6 V dc V = -6 V dc
CB EB
f = 1 MHz I = 0 I = 0
E C
V = -6 V dc 100 kHz f 1 MHz 100 kHz f 1 MHz
CE
I = -1 mA dc
C
2N2945A
2N2944A 2N2945A 2N2946A
pF pF
Min 15 10 5
Max 55 55 55 10 6
2