Product Information

BD50HC0MEFJ-CE2

BD50HC0MEFJ-CE2 electronic component of ROHM

Datasheet
Linear Voltage Regulators 1.0 A LDO REGULATOR

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.8406 ea
Line Total: USD 1.84

1982 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1941 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1
1 : USD 1.587
10 : USD 1.3685
100 : USD 1.196
250 : USD 1.1235
500 : USD 1.012
1000 : USD 0.8613
2500 : USD 0.8223
5000 : USD 0.8223
10000 : USD 0.7981

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Output Voltage
Output Current
Number of Outputs
Polarity
Input Voltage MAX
Input Voltage MIN
Output Type
Minimum Operating Temperature
Maximum Operating Temperature
Load Regulation
Line Regulation
Qualification
Packaging
Brand
Product Type
Factory Pack Quantity :
Subcategory
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Datasheet Automotive 1.0 A LDO Regulator BD50HC0MEFJ-C General Description Key Specifications BD50HC0MEFJ-C is a LDO regulator with output Input Power Supply Voltage Range: 4.5 V to 8.0 V current 1.0 A. The output accuracy is 3% between Ta Output Voltage: 5.0 V = -40 C to +125 C. It has package type: HTSOP-J8 Output Current: 1.0 A (Max) which is small and good heat resistance. Over current Shutdown Current: 0 A (Typ) protection (for protecting the IC from destruction by Ambient Temperature Range Ta: -40 C to +125 C output short circuit), circuit current ON/OFF switch (for setting the circuit 0 A at shutdown mode), and thermal shutdown circuit (for protecting IC from heat destruction by over load condition) are all built in. It is Package W (Typ) x D (Typ) x H (Max) usable for ceramic capacitor and enables to improve HTSOP-J8 4.90 mm x 6.00 mm x 1.00 mm smaller set and long-life. Features (Note 1) AEC-Q100 Qualified High Accuracy Reference Voltage Circuit Built-in Over Current Protection Circuit (OCP) Built-in Thermal Shutdown Circuit (TSD) With Shutdown Switch (Note 1) Grade1 Application Power Train Body Other Automotive Products Typical Application Circuit VCC VO Components Externally Connected C CIN O Input Capacitor: 1.0 F C (Min) IN (Note 2) Output Capacitor: 1.0 F C (Min) O VO S EN S (Note 2) Electrolytic, tantalum and ceramic capacitors can be used. GND EXP-PAD D Figure 1 Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays www.rohm.co.jp TSZ02201-0J4J0AD00010-1-1 2018 ROHM Co., Ltd. All rights reserved. 1/28 TSZ22111 14 001 26.Sep.2018 Rev.001 Datasheet BD50HC0MEFJ-C Contents General Description .............................................................................................................................................................. 1 Features ................................................................................................................................................................................ 1 Application ............................................................................................................................................................................ 1 Key Specifications ................................................................................................................................................................ 1 Package ................................................................................................................................................................................. 1 Typical Application Circuit .................................................................................................................................................... 1 Contents ................................................................................................................................................................................ 2 Pin Configuration .................................................................................................................................................................. 3 Pin Description ..................................................................................................................................................................... 3 Block Diagram....................................................................................................................................................................... 4 Description of Blocks ........................................................................................................................................................... 4 Absolute Maximum Ratings .................................................................................................................................................. 5 Operating Ratings ................................................................................................................................................................. 5 Electrical Characteristics .................................................................................................................................................... 5 Thermal Resistance ............................................................................................................................................................. 6 Typical Performance Curves ................................................................................................................................................. 7 Power Dissipation ............................................................................................................................................................... 16 Application and Implementation ......................................................................................................................................... 17 Selection of External Components .................................................................................................................................. 17 Input Pin Capacitor ...................................................................................................................................................... 17 Output Pin Capacitor .................................................................................................................................................... 17 Thermal Design ................................................................................................................................................................... 18 I/O Equivalence Circuits...................................................................................................................................................... 20 Linear Regulators Surge Voltage Protection ...................................................................................................................... 21 Applying Positive Surge to the Input ........................................................................................................................... 21 Applying Negative Surge to the input .......................................................................................................................... 21 Linear Regulators Reverse Voltage Protection................................................................................................................... 21 Reverse Input /Output Voltage ..................................................................................................................................... 21 Protection against Input Reverse Voltage.................................................................................................................... 22 Protection against Output Reverse Voltage when Output Connect to an Inductor ..................................................... 23 Operational Notes ............................................................................................................................................................... 24 1. Reverse Connection of Power Supply .................................................................................................................. 24 2. Power Supply Lines .............................................................................................................................................. 24 3. Ground Voltage ...................................................................................................................................................... 24 4. Ground Wiring Pattern .......................................................................................................................................... 24 5. Operating Ratings ................................................................................................................................................. 24 6. Inrush Current ....................................................................................................................................................... 24 7. Testing on Application Boards .............................................................................................................................. 24 8. Inter-pin Short and Mounting Errors ..................................................................................................................... 24 9. Unused Input Pins ................................................................................................................................................. 24 10. Regarding the Input Pin of the IC .......................................................................................................................... 25 11. Ceramic Capacitor ................................................................................................................................................. 25 12. Thermal Shutdown Circuit(TSD) ........................................................................................................................... 25 13. Over Current Protection Circuit (OCP) .................................................................................................................. 25 Ordering Information .......................................................................................................................................................... 26 Marking Diagram ................................................................................................................................................................. 26 Physical Dimension and Packing Information.................................................................................................................... 27 Revision History.................................................................................................................................................................. 28 www.rohm.com TSZ02201-0J4J0AD00010-1-2 2018 ROHM Co., Ltd. All rights reserved. 2/28 TSZ22111 15 001 26.Sep.2018 Rev.001

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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