Product Information

855817-EVB

855817-EVB electronic component of Qorvo

Datasheet
Signal Conditioning 1.96GHz BW 60MHz Eval Board

Manufacturer: Qorvo
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 191.3108
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Obsolete
     
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Product Category
RoHS - XON
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Packaging
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855817 1960 MHz SAW Filter Applications Wireless Infrastructure AMPS, CDMA and TDMA General Purpose RF Filter 4G, Multi-Standard Band 2 Downlink Repeaters SMP-12, 3.00 x 3.00 x 1.22 mm Product Features Functional Block Diagram 60 MHz Bandwidth Top View High Attenuation 6 1 Single-ended Operation Gnd Gnd 50 Ohm Impedance Small Size: 3.00 x 3.00 x 1.22 mm Input 5 Output 2 Ceramic Surface Mount Package (SMP) Hermetically Sealed 3 4 Gnd Gnd RoHS Compliant, Pb-Free Pb Hermetically sealed General Description Pin Configuration - Single Ended The 855817 is a Surface Acoustic Wave (SAW) based filter Pin No. Label suitable for LTE Band 2 Downlink. 2 Input 5 Output 855817 is specifically designed to meet the high performance expectations of insertion loss and rejection for 1.3,4,6 Ground LTE downlink systems under all operating conditions. This filter is housed in a compact, industry standard 3x3 mm footprint. Low insertion loss, coupled with high attenuation makes this filter an ideal choice for Base Station Applications. This filter is part of TriQuints wide portfolio of RF filters. Ordering Information Part No. Description 855817 1960 MHz SAW Filter 855817-EVB Evaluation board Standard T/R size = 5000 units/reel Data Sheet: Rev D 03-05-2014 Disclaimer: Subject to change without notice - 1 of 6 - 2014 TriQuint www.triquint.com 855817 1960 MHz SAW Filter Absolute Maximum Ratings Parameter Rating (1) Storage Temperature 40 to +85 C (2) Operable Temperature 40 to +85C Notes: 1. Operation of this device outside the parameter ranges given may cause permanent damage. 2. Specifications are not guaranteed over all operable conditions. (1,2,3) Electrical Specifications (2) Test conditions unless otherwise noted: Temp= 40 C to +85 C (3) (4) Parameter Conditions Min Typ Max Units Center Frequency - 1960 - MHz 1930 1990 MHz, +25C - 2.1 3.3 Insertion Loss dB 1930 1990 MHz - 2.1 4.5 - 1.0 1.6 1930 1990 MHz, +25C Passband Ripple - 1.6 2.2 dB p-p 1930 1990 MHz 10 1850 MHz 20 22 - 1850 1910 MHz, 30C to +85C 12 27 - 1850 1910 MHz 10.3 27 - Stopband Attenuation 2040 2100 MHz 25 26 - dB (relative to zero dB) 2150 2210 MHz 20 24 - 2210 4000 MHz 15 25 - Input/Output Return Loss 1930 1990 MHz 7.4 11 dB (4) Source Impedance single-ended - 50 - Ohms (4) Load Impedance single-ended - 50 - Ohms Notes: 1. All specifications are based on the test circuit shown below. 2. Production test is performed at room temp. to a guard-banded specification to ensure electrical compliance over temperature. 3. Electrical margin has been built into the design to account for variation due to temperature drift and manufacturing tolerances. 4. This is the optimum impedance in order to achieve the performance shown. Data Sheet: Rev D 03-05-2014 Disclaimer: Subject to change without notice - 2 of 6 - 2014 TriQuint www.triquint.com

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Qorvo
Qorvo, Inc.
RF9
RFMD
RFMD (Qorvo)
TriQuint
TriQuint (Qorvo)
TRIQUINT SEMI
TriQuint Semiconductor
TriQuint Semiconductor, Inc

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