Product Information

8007

8007 electronic component of Pomona

Datasheet
PCBs & Breadboards 6.50 X 4.50 X .062 042" Hole Diameter

Manufacturer: Pomona
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

4: USD 26.0424 ea
Line Total: USD 104.17

0 - Global Stock
MOQ: 4  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Warehouse 1


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 4
Multiples : 1

Stock Image

8007
Pomona

4 : USD 27.6959
10 : USD 18.7819
25 : USD 9.3555
50 : USD 8.8452
100 : USD 8.3349

     
Manufacturer
Product Category
RoHS - XON
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Products Prototyping Boards (Circbord ) VECTORBORD 8010 4.0 x 13.0 Precision-Drilled, Circuit Pattern: Pad-Per-Hole plated-thru holes Contacts: N/A 0.080 diameter, Width/Thick: 12.86 /.062 isolated solder pad Height: 4.00 around each hole Contacts: N/A Board size and 16-Pin DIP Capacity: 124 surface area approxi- Material: FR4 Epoxy Glass mate Macintosh II Wire-Wrap Terminals: T44, T46, T49, T68, specifications Solder Terminals: T42-1 Unrestricted Wire-Wrap Socket Pins: R32 component Hole Diameter: .042 placement 8001 4.50 x 6.5 Circuit Pattern: 3-Hole Solder Pad Circuit pattern etched Contacts: N/A onto wiring side only Width/Thick: 6.50 /.062 Solder mount DIP Height: 4.50 sockets or IC devices 16-Pin DIP Capacity: 20 with any lead spacing Material: CEM-1 3-hole solder pads (0.28 X 0.080 ) for Solder Terminals: T42-1, K24C, K31C interconnecting multiple Wire-Wrap Terminals: T44, T46, T49, T68 component leads Wire-Wrap Socket Pins: R32 Hole Diameter: .042 8002 4.5 x 6.5 Ideal for wire-wrap applications Circuit Pattern: Interleaved Buses Power and ground buses Contacts: N/A etched onto wiring side Width/Thick: 6.50 /.062 only Height: 4.50 Bus surfaces solder 16-Pin DIP Capacity: 36 coated for user Material: CEM-1 convenience Solder Terminals: T42-1 Mount components with 0.3 , 0.6 and 0.9 lead Wire-Wrap Terminals: T44, T46, T49, T68 spacing Wire-Wrap Socket Pins: R32 I/O area with solder pads Hole Diameter: .042 for mounting connector 8003 4.5 x 6.5 Circuit Pattern: Pad-Per-Hole Square solder pad Contacts: N/A etched around each Width/Thick: 6.50 /.062 hole on wiring side Height: 4.50 Accommodates any 16-Pin DIP Capacity: 60 type DIP IC device or Material: CEM-1 discrete component Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46. T49. T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042 11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Toll-Free (800) 423-5659 Web site: VECTORBORD Prototyping Boards (Circbord ) 8004 4.5 x 6.5 To commit wire-wrap pins to Circuit Pattern: Ground Plane voltage and ground planes, use Contacts: N/A Vector T124 solder washers, Width/Thick: 6.50 /.062 available separately Height: 4.50 0.085 diameter clearance 16-Pin DIP Capacity: 50 around holes Material: CEM-1 Etched overall ground plane on Solder Terminals: T42-1 wiring side only Plane surfaces solder-coated Wire-Wrap Terminals: T44, T46, T49, T68 for user convenience Wire-Wrap Socket Pins: R32 I/O area with solder pads for Hole Diameter: .042 mounting connector 8007 4.5 x 6.5 Pad-Per-Hole pattern on component side - overall Circuit Pattern: Pad-Per-Hole/ Ground Plane pattern on Ground Plane wiring side To commit wire-wrap pins to Contacts: N/A ground planes, use Vector T124 Width/Thick: 6.50 /.062 solder washers, available Height: 4.50 separately 16-Pin DIP Capacity: 60 0.080 diameter, isolated solder Material: CEM-1 pad around holes, component Solder Terminals: T42-1 side Wire-Wrap Terminals: T44, T46, T49, T68 Accommodates any type DIP IC device or discrete component Wire-Wrap Socket Pins: R32 Plane and pad surfaces solder- Hole Diameter: .042 coated for user convenience 8008 4.5 x 6.5 Circuit Pattern: Pads & Planes Unique circuit pattern features Contacts: N/A full voltage and ground planes on opposite sides with isolated, Width/Thick: 6.50 /.062 plated-thru holes Height: 4.50 0.080 diameter, isolated solder 16-Pin DIP Capacity: 70 pad around holes, component Material: FR4 Epoxy Glass side Solder Terminals: T42-1 Plane surfaces solder-coated Wire-Wrap Terminals: T44, T46, T49, T68 for user convenience Wire-Wrap Socket Pins: R32 SMD cap positions for discrete decoupling capacitors Hole Diameter: .042 3677-6 4.5 x 8.08 Circuit Pattern: 3-Hole Solder Pad Etched circuit pattern on wiring side only Contacts: N/A 0.080 diameter, isolated solder Width/Thick: 8.08 /.062 pad around holes, both sides Height: 4.50 3-hole solder pads 16-Pin DIP Capacity: 21 (0.028 X 0.080 ) for Material: CEM-1 interconnecting multiple Solder Terminals: T42-1 component leads Wire-Wrap Terminals: T44, T46, T49, T68 Pad and bus surfaces solder- coated for user convenience Wire-Wrap Socket Pins: R32 Hole Diameter: .042 Specifications subject to change without notice. ELECTRONIC COMPANY General Proto Products

Tariff Desc

8534.00.00 PRINTED CIRCUITS
33 No Single sided
38 No Double sided
Multilayer:
39 No .Having 4 layers
57 No .Having 6 or more layers
43 No Flexible circuits
44 No Other
Free

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