Product Information

SZNUP4301MR6T1G

SZNUP4301MR6T1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor ESD Suppressors MI TSOP6 LO CAP DIODE ARR

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.0235 ea
Line Total: USD 1.02

28808 - Global Stock
Ships to you between
Tue. 28 May to Thu. 30 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
21148 - WHS 1


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

SZNUP4301MR6T1G
ON Semiconductor

1 : USD 0.736
10 : USD 0.6451
100 : USD 0.4462
500 : USD 0.3726
1000 : USD 0.3174
3000 : USD 0.2829
6000 : USD 0.2817

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Cd - Diode Capacitance
Package / Case
Qualification
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Subcategory
Taric
Vf - Forward Voltage
LoadingGif

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NUP4301MR6, SZNUP4301MR6 Low Capacitance Diode Array for ESD Protection in Four Data Lines NUP4301MR6, SZNUP4301MR6 MAXIMUM RATINGS (Each Diode) (T = 25C unless otherwise noted) J Rating Symbol Value Unit Reverse Voltage V 70 Vdc R Forward Current I 200 mAdc F Peak Forward Surge Current I 500 mAdc FM(surge) Repetitive Peak Reverse Voltage V 70 V RRM Average Rectified Forward Current (Note 1) (averaged over any 20 ms period) I 715 mA F(AV) Repetitive Peak Forward Current I 450 mA FRM NonRepetitive Peak Forward Current I A FSM t = 1.0 s 2.0 t = 1.0 ms 1.0 t = 1.0 S 0.5 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR5 = 1.0 0.75 0.062 in. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient R 556 C/W JA Lead Solder Temperature, Maximum 10 Seconds Duration T 260 C L Junction Temperature T 40 to +150 C J Storage Temperature T 55 to +150 C stg ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) (Each Diode) J Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage V Vdc (BR) (I = 100 A) 70 (BR) Reverse Voltage Leakage Current I Adc R (V = 70 Vdc) 2.5 R (V = 25 Vdc, T = 150C) 30 R J (V = 70 Vdc, T = 150C) 50 R J Capacitance (between I/O pins) C pF D (V = 0 V, f = 1.0 MHz) 0.8 1.5 R Capacitance (between I/O pin and ground) C pF D (V = 0 V, f = 1.0 MHz) 1.6 3 R Forward Voltage V mV F dc (I = 1.0 mAdc) 715 F (I = 10 mAdc) 855 F (I = 50 mAdc) 1000 F (I = 150 mAdc) 1250 F Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 3. Include SZ-prefix devices where applicable.

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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