Product Information

SZESD7351P2T5G

SZESD7351P2T5G electronic component of ON Semiconductor

Datasheet
ESD Suppressors / TVS Diodes LOW CAP ESD IN SOD-923

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8143 ea
Line Total: USD 0.81

52331 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
14715 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

SZESD7351P2T5G
ON Semiconductor

1 : USD 0.5482
10 : USD 0.3925
100 : USD 0.1968
1000 : USD 0.1358
2500 : USD 0.1221
8000 : USD 0.1046
24000 : USD 0.1034
48000 : USD 0.0972

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Ipp - Peak Pulse Current
Cd - Diode Capacitance
Package / Case
Qualification
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Pd - Power Dissipation
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
Taric
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ESD7351, SZESD7351 Series ESD Protection Diode The ESD7351 Series is designed to protect voltage sensitive components that require ultra low capacitance from ESD and transient voltage events. Excellent clamping capability, low www.onsemi.com capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high MARKING DIAGRAMS frequency designs such as USB 2.0 high speed and antenna line applications. 2 SOD323 AF Features CASE 477 M 1 Low Capacitance (0.6 pF Max, I/O to GND) Low Clamping Voltage 2 Standoff Voltage: 3.3 V SOD523 AE CASE 502 Low Leakage 12 1 Response Time is < 1 ns Low Dynamic Resistance < 1 SOD923 AD M IEC6100042 Level 4 ESD Protection CASE 514AB SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and X, XX = Specific Device Code PPAP Capable M = Date Code These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant PIN CONFIGURATION Typical Applications AND SCHEMATIC RF Signal ESD Protection RF Switching, PA, and Antenna ESD Protection Near Field Communications 1 2 Cathode Anode MAXIMUM RATINGS Rating Symbol Value Unit IEC 6100042 (ESD) Contact 20 kV Air 20 ORDERING INFORMATION See detailed ordering and shipping information in the package Total Power Dissipation on FR5 Board P 150 mW D dimensions section on page 5 of this data sheet. (Note 1) T = 25C A Junction and Storage Temperature Range T , T 55 to +150 C J stg Lead Solder Temperature Maximum T 260 C L (10 Second Duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: November, 2018 Rev. 5 ESD7351/D MESD7351, SZESD7351 Series ELECTRICAL CHARACTERISTICS I (T = 25C unless otherwise noted) A I F Symbol Parameter I Maximum Reverse Peak Pulse Current PP V Clamping Voltage I C PP V V V V Working Peak Reverse Voltage C BR RWM RWM V I V R F I Maximum Reverse Leakage Current V I R RWM T V Breakdown Voltage I BR T I Test Current T *See Application Note AND8308/D for detailed explanations of I PP datasheet parameters. UniDirectional ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) A Parameter Symbol Conditions Min Typ Max Unit Reverse Working Voltage V 3.3 V RWM Breakdown Voltage (Note 2) V I = 1 mA 5.0 V BR T Reverse Leakage Current I V = 3.3 V < 1.0 50 nA R RWM Clamping Voltage (Note 3) V I = 1 A 8.0 V C PP Clamping Voltage (Note 3) V I = 3 A 10 V C PP Junction Capacitance C V = 0 V, f = 1 MHz 0.43 0.6 pF J R V = 0 V, f < 1 GHz 0.43 0.6 R Dynamic Resistance R TLP Pulse 0.35 DYN Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Breakdown voltage is tested from pin 1 to 2. 3. Nonrepetitive current pulse at T = 25C, per IEC6100045 waveform. A www.onsemi.com 2

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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