Product Information

NLX2G32AMX1TCG

NLX2G32AMX1TCG electronic component of ON Semiconductor

Datasheet
OR Gate 2-Element 2-IN 8-Pin ULLGA T/R

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3000: USD 0.0563 ea
Line Total: USD 168.9

0 - Global Stock
MOQ: 3000  Multiples: 3000
Pack Size: 3000
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 3000
Multiples : 3000

Stock Image

NLX2G32AMX1TCG
ON Semiconductor

3000 : USD 0.0563
3001 : USD 0.0313

0 - WHS 2


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 3000
Multiples : 3000

Stock Image

NLX2G32AMX1TCG
ON Semiconductor

3000 : USD 0.0563
3001 : USD 0.0313

     
Manufacturer
Product Category
High Level Output Current
Low Level Output Current
Packaging
Number Of Outputs
Mounting
Operating Supply Voltage Typ
Number Of Inputs
Operating Supply Voltage Min
Package Type
Number Of Elements
Operating Temp Range
Quiescent Current
Rad Hardened
Operating Temperature Classification
Operating Supply Voltage Max
Pin Count
Logical Function
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NLX2G32 Dual 2-Input OR Gate The NLX2G32 is a high performance dual 2input OR Gate operating from a 1.65 V to 5.5 V supply. Features Extremely High Speed: t 2.5 ns (typical) at V = 5 V PD CC NLX2G32 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to 7.0 V CC V DC Input Voltage 0.5 to 7.0 V I V DC Output Voltage 0.5 to 7.0 V O I DC Input Diode Current V < GND 50 mA IK I I DC Output Diode Current V < GND 50 mA OK O I DC Output Sink Current 50 mA O I DC Supply Current per Supply Pin 100 mA CC I DC Ground Current per Ground Pin 100 mA GND T Storage Temperature Range 65 to 150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature under Bias 150 C J Thermal Resistance (Note 1) 250 C/W JA P Power Dissipation in Still Air at 85C 250 mW D MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 2) > 2000 V ESD Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I LatchUp Performance Above V and Below GND at 85C (Note 5) 500 mA LatchUp CC Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow. 2. Tested to EIA/JESD22A114 A. 3. Tested to EIA/JESD22A115 A. 4. Tested to JESD22C101A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Supply Voltage Operating 1.65 5.5 V CC Data Retention Only 1.5 5.5 V Input Voltage (Note 6) 0 5.5 V I V Output Voltage (HIGH or LOW State) 0 V V O CC T Operating FreeAir Temperature 40 85 C A t/ V Input Transition Rise or Fall Rate V = 1.8 V 0.15 V 0 20 ns/V CC V = 2.5 V 0.2 V 0 20 CC V = 3.0 V 0.3 V 0 10 CC V = 5.0 V 0.5 V 0 5 CC 6. Unused inputs may not be left open. All inputs must be tied to a highlogic voltage level or a lowlogic input voltage level.

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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