Product Information

NCP717AMX190TCG

NCP717AMX190TCG electronic component of ON Semiconductor

Datasheet
LDO Voltage Regulators 300 MA LDO LOW IQ LOW N

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 6000
Multiples : 3000

Stock Image

NCP717AMX190TCG
ON Semiconductor

6000 : USD 0.0902
60000 : USD 0.0864
600000 : USD 0.0847
N/A

Obsolete
0 - WHS 2

MOQ : 6000
Multiples : 3000

Stock Image

NCP717AMX190TCG
ON Semiconductor

6000 : USD 0.0772
N/A

Obsolete
0 - WHS 3

MOQ : 1
Multiples : 1

Stock Image

NCP717AMX190TCG
ON Semiconductor

1 : USD 0.4708
10 : USD 0.3816
100 : USD 0.2179
1000 : USD 0.1393
3000 : USD 0.1199
9000 : USD 0.1102
24000 : USD 0.1089
45000 : USD 0.1052
99000 : USD 0.1015
N/A

Obsolete
     
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Product Category
RoHS - XON
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NCP717 300 mA, Very-Low Quiescent Current, I 25 A, Q Low Noise, Low Dropout Regulator www.onsemi.com The NCP717 is 300 mA LDO that provides the engineer with a very stable, accurate voltage with very low noise suitable for space MARKING constrained, noise sensitive applications. In order to optimize DIAGRAM performance for battery operated portable applications, the NCP717 1 employs the dynamic quiescent current adjustment for very low I Q consumption at noload. XDFN4 X M MX SUFFIX 1 Features CASE 711AJ Operating Input Voltage Range: 1.8 V to 5.5 V X = Specific Device Code Available in Fixed Voltage Options: 0.8 V to 5 V M = Date Code Contact Factory for Other Voltage Options Very Low Quiescent Current of Typ. 25 A Very Low Noise: 22 V from 100 Hz to 100 kHz RMS PIN CONNECTION Low Dropout: 175 mV Typical at 300 mA IN EN 2% Accuracy Over Load/Line/Temperature 43 High Power Supply Ripple Rejection: 70 dB at 1 kHz Thermal Shutdown and Current Limit Protections Stable with a 1 F Ceramic Output Capacitor EPAD Available in XDFN 1.0 x 1.0 mm Package These are PbFree Devices 1 2 Typical Applicaitons OUT GND PDAs, Mobile phones, GPS, Smartphones (Top View) Wireless Handsets, Wireless LAN, Bluetooth , Zigbee Portable Medical Equipment ORDERING INFORMATION Other Battery Powered Applications See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet. V V IN OUT IN OUT NCP717 C C IN OUT EN 1 F ON GND Ceramic OFF Figure 1. Typical Application Schematic Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: November, 2015 Rev. 8 NCP717/DNCP717 IN ENABLE THERMAL EN LOGIC SHUTDOWN BANDGAP MOSFET REFERENCE DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE* EN GND *Active output discharge function is present only in NCP717AMXyyyTCG and NCP717CMXyyyTCG devices. yyy denotes the particular V option. OUT Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 F is needed from this pin to ground to assure stability. 2 GND Power supply ground. 3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) V 0.3 V to 6 V V IN Output Voltage VOUT 0.3 V to VIN + 0.3 V V Enable Input VEN 0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC s Maximum Junction Temperature T 150 C J(MAX) Storage Temperature T 55 to 150 C STG ESD Capability, Human Body Model (Note 2) ESD 2000 V HBM ESD Capability, Machine Model (Note 2) ESD 200 V MM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22A114, ESD Machine Model tested per EIA/JESD22A115, Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, XDFN4 1x1 mm R 250 C/W JA Thermal Resistance, JunctiontoAir www.onsemi.com 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aptina / ON Semiconductor
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild

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