Product Information

MMSF3P02HDR2G

MMSF3P02HDR2G electronic component of ON Semiconductor

Datasheet
MOSFET PFET SO8S 20V 5.6A 75mOhm

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

2500: USD 0.5416 ea
Line Total: USD 1354

0 - Global Stock
MOQ: 2500  Multiples: 2500
Pack Size: 2500
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 2500
Multiples : 2500

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MMSF3P02HDR2G
ON Semiconductor

2500 : USD 1.0162

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

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MMSF3P02HDR2G
ON Semiconductor

1 : USD 2.1023

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May


Multiples : 1

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MMSF3P02HDR2G
ON Semiconductor


0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 2500
Multiples : 2500

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MMSF3P02HDR2G
ON Semiconductor

2500 : USD 0.5416
5000 : USD 0.5416
7500 : USD 0.5416
10000 : USD 0.5416

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 496
Multiples : 496

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MMSF3P02HDR2G
ON Semiconductor

496 : USD 0.7578

0 - Global Stock


Ships to you between
Fri. 10 May to Wed. 15 May

MOQ : 1
Multiples : 1

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MMSF3P02HDR2G
ON Semiconductor

1 : USD 2.5684
10 : USD 2.5075
30 : USD 2.4662
100 : USD 2.4247

0 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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MMSF3P02HDR2G
ON Semiconductor

1 : USD 4.5049
10 : USD 1.6156
100 : USD 1.2635
500 : USD 1.046
1000 : USD 0.8213
2500 : USD 0.7705

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 10
Multiples : 1

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MMSF3P02HDR2G
ON Semiconductor

10 : USD 0.8728
25 : USD 0.7265
100 : USD 0.6655
250 : USD 0.6522

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Channel Mode
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Height
Length
Transistor Type
Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
LoadingGif

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MMSF3P02HD Power MOSFET 3 Amps, 20 Volts PChannel SO8 These miniature surface mount MOSFETs feature ultra low R DS(on) and true logic level performance. They are capable of withstanding MMSF3P02HD ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) (Note 3) A Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V Vdc (BR)DSS 20 (V = 0 Vdc, I = 250 Adc) GS D Temperature Coefficient (Positive) 24 mV/C Zero Gate Voltage Drain Current I Adc DSS (V = 20 Vdc, V = 0 Vdc) 1.0 DS GS (V = 20 Vdc, V = 0 Vdc, T = 125C) 10 DS GS J GateBody Leakage Current (V = 20 Vdc, V = 0) I 100 nAdc GS DS GSS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V Vdc GS(th) (V = V , I = 250 Adc) 1.0 1.5 2.0 DS GS D Temperature Coefficient (Negative) 4.0 mV/C Static DrainSource OnResistance R DS(on) (V = 10 Vdc, I = 3.0 Adc) 0.06 0.075 GS D (V = 4.5 Vdc, I = 1.5 Adc) 0.08 0.095 GS D Forward Transconductance (V = 3.0 Vdc, I = 1.5 Adc) g 3.0 7.2 mhos DS D FS DYNAMIC CHARACTERISTICS Input Capacitance C 1010 1400 pF iss (V = 16 Vdc, V = 0 Vdc, DS GS Output Capacitance C 740 920 oss f = 1.0 MHz) Transfer Capacitance C 260 490 rss SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 25 50 ns d(on) Rise Time t 135 270 r (V = 10 Vdc, I = 3.0 Adc, DD D V = 4.5 Vdc, R = 6.0 ) GS G Turn Off Delay Time t 54 108 d(off) Fall Time t 84 168 f TurnOn Delay Time t 16 32 d(on) Rise Time t 40 80 r (V = 10 Vdc, I = 3.0 Adc, DD D V = 10 Vdc, R = 6.0 ) GS G Turn Off Delay Time t 110 220 d(off) Fall Time t 97 194 f Gate Charge Q 33 46 nC T See Figure 8 Q 3.0 1 (V = 16 Vdc, I = 3.0 Adc, DS D V = 10 Vdc) GS Q 11 2 Q 10 3 SOURCEDRAIN DIODE CHARACTERISTICS Forward OnVoltage (Note 4) V Vdc SD (I = 3.0 Adc, V = 0 Vdc) S GS 1.35 1.75 (I = 3.0 Adc, V = 0 Vdc, T = 125C) S GS J 0.96 Reverse Recovery Time t 76 ns rr See Figure 15 t 32 a (I = 3.0 Adc, V = 0 Vdc, S GS dI /dt = 100 A/ s) S t 44 b Reverse Recovery Stored Charge Q 0.133 C RR 3. Negative sign for PChannel device omitted for clarity. 4. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 5. Switching characteristics are independent of operating junction temperature.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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