Product Information

LV8549MC-AH

LV8549MC-AH electronic component of ON Semiconductor

Datasheet
Motor/Motion/Ignition Controllers & Drivers 2-CH BRUSH MOTOR DRIVER

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.0575 ea
Line Total: USD 1.06

4850 - Global Stock
Ships to you between
Fri. 10 May to Wed. 15 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
456 - Global Stock


Ships to you between
Fri. 10 May to Wed. 15 May

MOQ : 1
Multiples : 1

Stock Image

LV8549MC-AH
ON Semiconductor

1 : USD 1.1405
10 : USD 0.9708
30 : USD 0.884
100 : USD 0.7991
500 : USD 0.659
1000 : USD 0.6314

     
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RoHS - XON
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Operating Supply Voltage
Output Current
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Ordering number : ENA2039C LV8549MC Monolithic Linear IC LV8549MC Electrical Characteristics at Ta = 25 C, V = 12V CC Ratings Parameter Symbol Conditions Unit min typ max Power supply voltage I 0 Standby mode ENA=L 1 A CC ENA=H , no-load I 1 1.7 2.3 mA CC Input current I V=5V 3050 65 A IN IN Thermal shutdown operating Ttsd Design certification 150 180 210 C temperature Temperature hysteresis width Ttsd Design certification 40 C Low voltage protection function VthV 3.3 3.5 3.65 V CC operation voltage Release voltage Vthret 3.55 3.8 3.95V Output ON resistance R I=1.0A 0.71 1.25 ON OUT (Upper and lower total) Output leak current Ileak V=16V 10 A O O Diode forward voltage VD ID=1.0A 1.0 1.2 V Package Dimensions SOIC-10NB CASE 751BQ-01 ISSUE A 2X NOTES: 0.10 C A-B 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. D 2. CONTROLLING DIMENSION: MILLIMETERS. D 3. DIMENSION b DOES NOT INCLUDE DAMBAR A PROTRUSION. ALLOWABLE PROTRUSION 2X SHALL BE 0.10mm TOTAL IN EXCESS OF b AT MAXIMUM MATERIAL CONDITION. 0.10 C A-B F 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE 10 6 BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm H E PER SIDE. DIMENSIONS D AND E ARE DE- TERMINED AT DATUM F. 1 5. DIMENSIONS A AND B ARE TO BE DETERM- 5 L2 INED AT DATUM F. A3 6. A1 IS DEFINED AS THE VERTICAL DISTANCE L SEATING C FROM THE SEATING PLANE TO THE LOWEST PLANE 0.20 C 10X b POINT ON THE PACKAGE BODY. DETAIL A B 2X 5 TIPS M MILLIMETERS 0.25 C A-B D DIM MIN MAX TOP VIEW A 1.25 1.75 A1 0.10 0.25 10X A3 0.17 0.25 h b 0.31 0.51 X 45 0.10 C 0.10 C D 4.80 5.00 E 3.80 4.00 M e 1.00 BSC H 5.80 6.20 h 0.37 REF A L 0.40 1.27 DETAIL A e A1 SEATING L2 0.25 BSC C PLANE M 0 8 END VIEW SIDE VIEW GENERIC RECOMMENDED MARKING DIAGRAM* SOLDERING FOOTPRINT* 10 1.00 10X 0.58 XXXXX PITCH ALYWX 1 XXXXX = Specific Device Code 6.50 A = Assembly Location L = Wafer Lot Y = Year W = Work Week = PbFree Package 1 10X 1.18 DIMENSION: MILLIMETERS *This information is generic. Please refer to device data sheet for actual part *For additional information on our PbFree strategy and soldering marking. PbFree indicator, G, may details, please download the ON Semiconductor Soldering and or not be present. Mounting Techniques Reference Manual, SOLDERRM/D. No.A2039-2/10

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

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