AR0835HS AR0835HS 1/3.2inch 8 Mp CMOS Digital Image Sensor Table 1. KEY PERFORMANCE PARAMETERS Parameter Value www.onsemi.com Array Format 8 Mp: 3264 2448 6 Mp: 3264 1836 Primary Modes 4:3 8 Mp 46 fps Max (HiSPi) and 42 fps Max (MIPI) 16:9 6 Mp at 60 fps Max 1080p 60 fps / 720p 120 fps Max Pixel Size 1.4 m Back Side Illuminated (BSI) CLCC48 10 10 Optical Format 1/3.2 CASE 848AJ 2 Die Size 6.86 mm 6.44 mm (Area: 44.17 mm ) Input Clock Frequency 627 MHz ORDERING INFORMATION Interface HiSPi Mode: 4 lanes at 1 Gbps Max. See detailed ordering and shipping information on page 2 of MIPI Mode: CSI2 (2, 3, 4 lanes) at this data sheet. 896 Mbps max. Subsampling Modes X Bin2, Sum2 Skip: 2, 4 Features (Continued) Y Sum2, Skip: 2, 4, 8 Data Output Serial Interface: Four-lane Output Data Depth 10-bit Raw, 10-to-8 bit A-Law, 8/6-bit DPCM High-speed Serial Pixel Interface (HiSPi) or Analog Gain 1, 2, 3, 4, 6, 8 Mobile Industry Processor Interface (MIPI) High Quality Bayer Scalar Adjustable Scaling Up to 1/6 Scaling Bit-depth Compression Available for Serial Temperature Sensor 10-bit, Single Instance on Chip, Interface: 10-to-8 and 10-6 Bit Compression Controlled by Two-wire Serial I/F to Enable Lower Bandwidth Receivers for VCM AF Driver 8-bit Resolution with Slew Rate Control Full Frame Rate Applications 3D Support Frame Rate and Exposure Synchronization On-chip Temperature Sensor Supply Voltage On-die Phase-locked Loop (PLL) Oscillator Analog 2.53.1 V (2.8 V Nominal) 5.6 kbits One-time Programmable Memory Digital 1.141.3 V (1.2 V Nominal) Pixel 2.53.1 V (2.8 V Nominal) (OTPM) for Storing Module Information I/O 1.71.9 V (1.8 V Nominal) or and Calibration Data 2.53.1 V (2.8 V Nominal) HiSPi/MIPI 1.141.3 V (1.2 V Nominal) On-chip 8-bit VCM Driver 3D Synchronization Controls to Enable OTPM Program Voltage 6.5 V Stereo Video Capture Power Consumption Typical 420 mW at 25C for 8 Mp/46 fps and 6 Mp/60 fps Interlaced Multi-exposure Readout Enabling High Dynamic Range (HDR) Still and Video Responsivity 0.6 V/luxsec Applications SNR 36 dB MAX Programmable Controls: Gain, Horizontal Dynamic Range 64 dB and Vertical Blanking, Auto Black Level Operating Temperature 30C to +70C Offset Correction, Frame Size/Rate, Range (at Junction) T J Exposure, Left-right and Top-bottom Image Reversal, Window Size, and Panning Features Support for External Mechanical Shutter High Speed Sensor Supporting 8 Mp (4:3) and 6 Mp (16:9) Up to Support for External LED or Xenon Flash 60 fps 1.4 Pixel with ON Semiconductor APixHS Technology Applications Providing Best-in-class Low-light Performance Sports Cameras Optional On-chip High-quality Bayer Scaler to Resize Image to Digital Still Cameras Desired Size Digital Video Cameras Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: February, 2017 Rev. 4 AR0835HS/DAR0835HS Table 2. MODE OF OPERATION AND POWER CONSUMPTION Typical Power Active Readout Sensor Output Resolution Consumption Window (Col Row) (Col Row) (Note 2) Mode Mode FPS FULL RESOLUTION 4:3 8Mp 3264 2448 3264 2448 Full Mode 46/42 420 mW 8Mp 3264 2448 3264 2448 Full Mode 30 370 mW FULL RESOLUTION 16:9 6Mp 3264 1836 3264 1836 Full Mode 60 420 mW 6Mp 3264 1836 3264 1836 Full Mode 30 370 mW 4:3 VIDEO MODE VGA 3264 2448 640 480 Skip4 180 370 mW QVGA 3264 2448 320 240 Skip4 240 370 mW 16:9 VIDEO MODE 1080p 3264 1836 1920 1080 Scaling 30 360 mW 1080p 3264 1836 1920 1080 Scaling 60 420 mW 720p 3264 1836 1280 720 Bin2Sum2 120 390 mW 720p 3264 1836 1280 720 Scaling 60 420 mW 720p 3264 1836 1280 720 Bin2 + Scaling 60 250 mW 1. Gbps/Lane HiSPi and 896 Mbps/Lane MIPI data transfer rate. 2. Values measured at T = 25C and nominal voltages. ORDERING INFORMATION Table 3. AVAILABLE PART NUMBERS Part Number Product Description Orderable Product Attribute Description AR0835HS3C12SUAA0DP 8 MP 1/3 CIS Dry Pack with Protective Film AR0835HS3C12SUAA0DR 8 MP 1/3 CIS Dry Pack without Protective Film See the ON Semiconductor Device Nomenclature documentation, including information on evaluation kits, document (TND310/D) for a full description of the naming please visit our web site at www.onsemi.com. convention used for image sensors. For reference GENERAL DESCRIPTION The AR0835HS from ON Semiconductor is a 1/3.2-inch The AR0835HS digital image sensor features BSI (back side illuminated) CMOS active-pixel digital ON Semiconductors breakthrough low-noise 1.4 m pixel image sensor with a pixel array of 3264 (H) 2448 (V) CMOS imaging technology that achieves near-CCD image (3280 (H) 2464 (V) including border pixels). It quality (based on signal-to-noise ratio and low-light incorporates sophisticated on-chip camera functions such as sensitivity) while maintaining the inherent size, cost, and mirroring, column and row skip modes, and context integration advantages of CMOS. switching for zero shutter lag snapshot mode. It is programmable through a simple two-wire serial interface and has very low power consumption. www.onsemi.com 2