OSD3358-512M-ICB

OSD335x C-SiP Family Rev. 2 3/20/2019 Introduction The OSD335x C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara ARM Cortex-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 OSD335x C-SiP Block Diagram Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, Access to all* AM335x Peripherals: capacitors, and inductors into a single CAN, SPI, UART, I2C, GPIO, etc. 27mm x 27mm easy to use IC package. Up to 1GB DDR3 With this level of integration, the OSD335x Up to 16GB eMMC C-SiP has everything needed to build a Low Power, Low Jitter MEMS Oscillator complete embedded computing platform. It PWR In: AC Adapter, USB or Single cell allows designers to focus on the key (1S) Li-Ion / Li-Po Battery aspects of their system without spending PWR Out: 1.8V, 3.3V and SYS time on the complications associated with Selectable I/O Voltage: 1.8V or 3.3V getting the processing core working. It also reduces the overall size and complexity of Benefits the design while simplifying the supply chain. The OSD335x C-SiP can Integrates over 100 components significantly decrease the time to market for Compatible with AM335x development any embedded computing products. tools and software Significantly reduces design time Features 45% reduction in board space vs discrete implementation TI AM335x, TPS65217C, TL5209, Decreases layout complexity DDR3, EEPROM, eMMC, MEMS Wide BGA ball pitch allows for low-cost Oscillator and passive components assembly integrated into a single package Simplifies component sourcing TI AM335x Features: Increased reliability through reduced o ARM Cortex-A8 up to 1GHz number of components o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 Package o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 400 Ball BGA (27mm X 27mm) o LCD Controller 20 X 20 grid, 1.27mm pitch o SGX 3D Graphics Engine Temp Range: 0 to 85C, -40 to 85C o PRU Subsystem * Access to All IO except those used for communicating with the eMMC Octavo Systems LLC Copyright 2019 2 OSD335x C-SiP Family Rev. 2 3/20/2019 Table of Contents 1 Revision History ....................................................................................... 4 2 Block Diagram ......................................................................................... 5 2.1 Passives ........................................................................................... 6 2.1.1 Additional Required Bulk Capacitance .................................................. 6 2.1.2 Integrated Bulk Capacitance ............................................................. 6 2.1.3 Integrated Resistors ........................................................................ 7 3 Product Number Information ........................................................................ 8 4 Reference Documents ............................................................................... 10 4.1 Data Sheets ...................................................................................... 10 4.2 Other References ............................................................................... 10 5 Ball Map ............................................................................................... 11 5.1 Ball Description ................................................................................. 17 5.2 Internal Use Only AM335x Signal Pins ........................................................ 20 5.3 Not Connected Balls ............................................................................ 21 5.4 Reserved Signals ................................................................................ 21 6 OSD335x C-SiP Components ........................................................................ 22 6.1 AM335x Processor ............................................................................... 23 6.1.1 I/O Voltages ................................................................................ 23 6.1.2 Reset Circuitry ............................................................................. 23 6.2 DDR3 Memory.................................................................................... 24 6.3 MEMS Oscillator ................................................................................. 25 6.4 eMMC ............................................................................................. 26 6.4.1 Powering the eMMC ....................................................................... 26 6.4.2 Booting from the eMMC................................................................... 26 6.5 EEPROM .......................................................................................... 27 6.5.1 EEPROM Contents ......................................................................... 27 6.5.2 EEPROM Write Protection ................................................................ 27 7 Power Management .................................................................................. 28 7.1 Input Power...................................................................................... 28 7.1.1 VIN AC ...................................................................................... 28 7.1.2 VIN USB ..................................................................................... 28 Octavo Systems LLC Copyright 2019