MIMX8MN6DVTJZAA

Document Number: IMX8MNCEC NXP Semiconductors Rev. 1, 03/2021 Data Sheet: Technical Data MIMX8MN6DVTJZAA MIMX8MN6DVTJZCA MIMX8MN6DVTJZDA MIMX8MN5DVTJZAA MIMX8MN4DVTJZAA MIMX8MN3DVTJZAA MIMX8MN2DVTJZAA MIMX8MN1DVTJZAA MIMX8MN5DVPIZCA MIMX8MN5DVPIZDA MIMX8MN5DVPIZAA MIMX8MN3DVPIZAA MIMX8MN1DVPIZAA i.MX 8M Nano Applications Processor Datasheet for Consumer Package Information Plastic Package Products FCBGA 14 x 14 mm, 0.5 mm pitch FCBGA 11 x 11 mm, 0.5 mm pitch Ordering Information See Table 3 on page 6 1 i.MX 8M Nano introduction The i.MX 8M Nano application processor represents 1. i.MX 8M Nano introduction . 1 1.1. Block diagram 5 NXPs latest graphics and audio experience combining 1.2. Ordering information . 6 state-of-the-art media-specific features with 2. Modules list . 9 2.1. Recommended connections for unused input/output high-performance processing while optimized for lowest 13 power consumption. 3. Electrical characteristics 15 3.1. Chip-level conditions 15 The i.MX 8M Nano family of processors features 3.2. Power supplies requirements and restrictions . 28 3.3. PLL electrical characteristics 34 advanced implementation of a quad Arm Cor- 3.4. On-chip oscillators 35 tex -A53 core, which operates at speeds of up to 3.6. I/O AC parameters . 37 3.7. Output buffer impedance parameters . 38 1.5 GHz. A general purpose Cortex -M7 running up to 3.8. System modules timing 40 3.9. External peripheral interface parameters 41 750 MHz core processor is for real-time and low-power 4. Boot mode configuration 75 processing. 4.1. Boot mode configuration pins . 75 4.2. Boot device interface allocation 75 The i.MX 8M Nano family of processors provides addi- 5. Package information and contact assignments . 77 tional computing resources and peripherals: 5.1. 14 x 14 mm package information 77 Advanced security modules for secure boot, 5.2. 11 x 11 mm package information 93 5.3. DDR pin function list . 108 cipher acceleration and DRM support 6. Revision history 111 A wide range of audio interfaces, including I2S, AC 97, TDM, and S/PDIF Large set of peripherals that are commonly used in consumer/industrial market, including USB and Ethernet NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. 2019-2021 NXP Semiconductors All rights reserved.i.MX 8M Nano introduction Table 1. Features Subsystem Feature Cortex -A53 MPCore platform Quad symmetric Cortex -A53 processors 32 KB L1 Instruction Cache 32 KB L1 Data Cache TM Media Processing Engine (MPE) with Arm NEON technology supporting the Advanced Single Instruction Multiple Data architecture: Floating Point Unit (FPU) with support of the Arm VFPv4-D16 architecture Support of 64-bit Arm v8-A architecture 512 KB unified L2 cache Cortex -M7 core platform Low power microcontroller available for customer application: low power standby mode IoT features including Weave Manage IR or wireless remote ML inference applications (enhanced for i.MX 8M Nano) Cortex M7 CPU: 256 KB tightly coupled memory (TCM) Connectivity One USB 2.0 OTG controllers with integrated PHY interfaces: Spread spectrum clock support Three Ultra Secure Digital Host Controller (uSDHC) interfaces: MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec Support for SDXC (extended capacity) One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588 Four Universal Asynchronous Receiver/Transmitter (UART) modules 2 Four I C modules Three SPI modules On-chip memory Boot ROM (256 KB) On-chip RAM (512 KB + 32 KB) GPIO and pin multiplexing General-purpose input/output (GPIO) modules with interrupt capability Input/output multiplexing controller (IOMUXC) to provide centralized pad control Power management Temperature sensor with programmable trip points Flexible power domain partitioning with internal power switches to support efficient power management i.MX 8M Nano Applications Processor Datasheet for Consumer Products, Rev. 1, 03/2021 2 NXP Semiconductors