Product Information

MCIMX353CJQ5C

MCIMX353CJQ5C electronic component of NXP

Datasheet
Microprocessors - MPU RINGO MX35 TO2.1

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 44.2091 ea
Line Total: USD 44.21

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 08 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 43.875
10 : USD 33.7836
80 : USD 28.8488

0 - WHS 2


Ships to you between Wed. 08 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 19.5156

0 - WHS 3


Ships to you between Tue. 14 May to Thu. 16 May

MOQ : 450
Multiples : 450
450 : USD 24.725

     
Manufacturer
Product Category
Core
Data Bus Width
Maximum Clock Frequency
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
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Freescale Semiconductor Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 Data Sheet: Technical Data IMX35 Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch i.MX35 Applications Processors for Ordering Information Industrial and See Table 1 on page 3 for ordering information. Consumer Products 1. Introduction 1 1 Introduction 1.1. Features 2 1.2 Ordering Information 3 The i.MX353 and the i.MX357 multimedia applications 1.3. Block Diagram . 5 2 Functional Description and Application Information 4 processors represent the next generation of ARM11 2.1. Application Processor Domain Overview . 5 products with the right performance and integration to 2.2. Shared Domain Overview 6 2.3. Advanced Power Management Overview 6 address applications within the industrial and consumer 2.4. ARM11 Microprocessor Core 6 markets for applications such as HMI and display 2.5. Module Inventory . 7 controllers. Unless otherwise specified, the material in 3. Signal Descriptions: Special Function Related Pins 12 4. Electrical Characteristics . 12 this data sheet is applicable to both the i.MX353 and 4.1. i.MX35 Chip-Level Conditions 12 i.MX357 devices and referred to singularly throughout 4.2. Power Modes . 15 4.3. Supply Power-Up/Power-Down Requirements and this document as i.MX35 or MCIMX35. The i.MX353 Restrictions 16 devices do not include a graphics processing unit 4.4. Reset Timing . 17 (GPU). For information on i.MX35 devices for 4.5. Power Characteristics 18 4.6. Thermal Characteristics . 19 automotive applications, please refer to document 4.7. I/O Pin DC Electrical Characteristics . 20 number, MCIMX35SR2AEC. 4.8. I/O Pin AC Electrical Characteristics . 23 4.9. Module-Level AC Electrical Specifications . 29 The i.MX35 processor takes advantage of the 5. Package Information and Pinout 130 5.1. MAPBGA Production Package 1568-01, 17 17 mm, ARM1136JF-S core running at 532 MHz that is 0.8 Pitch 131 boosted by a multi-level cache system and integrated 5.2. MAPBGA Signal Assignments . 132 features such as LCD controller, Ethernet, and graphics 6. Product Documentation . 144 7. Revision History . 145 acceleration for creating rich user interfaces. The i.MX35 supports connections to various types of external memories, such as SDRAM, mobile DDR, and DDR2, SLC and MCL NAND Flash, NOR Flash and Freescale Semiconductor, Inc., 2010. All rights reserved.SRAM. The devices can be connected to a variety of external devices such as USB 2.0 OTG, ATA, MMC/SDIO, and Compact Flash. 1.1 Features It provides low-power solutions for applications demanding high-performance multimedia and graphics. The i.MX35 is based on the ARM1136 platform, which has the following features: ARM1136JF-S processor, version r1p3 16-Kbyte L1 instruction cache 16-Kbyte L1 data cache 128-Kbyte L2 cache, version r0p4 128 Kbytes of internal SRAM Vector floating point unit (VFP11) To boost multimedia performance, the following hardware accelerators are integrated: Image processing unit (IPU) OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351) The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed and not available simultaneously): 2 controller area network (CAN) interfaces 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351) 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz) 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each) Enhanced serial audio interface (ESAI) 2 synchronous serial interfaces (SSI) Ethernet MAC 10/100 Mbps 1 USB 2.0 host with ULPI interface or internal full-speed PHY. Up to 480 Mbps if external HS PHY is used. 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY Flash controllerMLC/SLC NAND and NOR GPIO with interrupt capabilities 2 3 I C modules (up to 400 Kbytes each) JTAG Key pin port Asynchronous sample rate converter (ASRC) 1-Wire Parallel camera sensor (4/8/10/16-bit data port for video color models: YCC, YUV, 30 Mpixels/s) Parallel display (primary up to 24-bit, 1024 x 1024) Parallel ATA (up to 66 Mbytes) (not available for the MCIMX351) i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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