Product Information

BAP50-03

BAP50-03 electronic component of NXP

Datasheet
DIODE, PIN, 0.05A, SOD-323

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.1336 ea
Line Total: USD 0.67

0 - Global Stock
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 5
Multiples : 1
5 : USD 0.1336
10 : USD 0.1166
25 : USD 0.0813
100 : USD 0.0636
250 : USD 0.051
500 : USD 0.046

     
Manufacturer
Product Category
Packaging
Diode Configuration
Resistance If
Diode Case Style
No Of Pins
Forward Current Ifav
Operating Temperature Max
Msl
Svhc
Capacitance Cd Vr Min
Capacitance Cd Max Vr F
Diode Type
Forward Test Current If
Forward Voltage Vf Max
Operating Temperature Min
Operating Temperature Range
Peak Forward Current
Power Dissipation Ptot Max
Repetitive Reverse Voltage Vrrm Max
Reverse Voltage Vr Max
Termination Type
LoadingGif

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BAP50-03 General purpose PIN diode Rev. 04 11 September 2009 Product data sheet 1. Product prole 1.1 General description General purpose PIN diode in a SOD323 small plastic SMD package. 1.2 Features n Low diode capacitance n Low diode forward resistance 1.3 Applications n General RF application 2. Pinning information Table 1. Discrete pinning Pin Description Simplied outline Graphic symbol 1 cathode 1 2 2 anode sym006 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BAP50-03 SC-76 plastic surface-mounted package 2 leads SOD323BAP50-03 NXP Semiconductors General purpose PIN diode 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V reverse voltage - 50 V R I forward current - 50 mA F P total power dissipation T =90 C - 500 mW tot sp T storage temperature - 65 +150 C stg T junction temperature - 65 +150 C j 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction 85 K/W th(j-sp) to soldering point 6. Characteristics Table 5. Characteristics T = 25 C unless otherwise specied. j Symbol Parameter Conditions Min Typ Max Unit V forward voltage I = 50 mA - 0.95 1.1 V F F V reverse voltage I =10 A 50 --V R R I reverse current V = 50 V - - 100 nA R R C diode capacitance f = 1 MHz see Figure 1 d V = 0 V - 0.4 - pF R V = 1 V - 0.3 0.55 pF R V = 5 V - 0.2 0.35 pF R r diode forward resistance f = 100 MHz see Figure 2 D 1 I = 0.5 mA -25 40 F 1 I =1mA -14 25 F 1 I =10mA -3 5 F 1 Guaranteed on AQL basis: inspection level S4, AQL 1.0. BAP50-03 4 NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 11 September 2009 2 of 7

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
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Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
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NXP SEMICONDUCTOR
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PH3
PHI

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