ISD1730SY

ISD1700 DATASHEET ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices Publication Release Date:Feb 4, 2010 - 1 - Revision 2.0 ISD1700 DATASHEET TABLE OF CONTENTS 1 GENERAL DESCRIPTION .............................................................................................................. 3 2 FEATURES ...................................................................................................................................... 4 3 BLOCK DIAGRAM ........................................................................................................................... 5 4 PINOUT CONFIGURATION ............................................................................................................ 6 5 PIN DESCRIPTION ......................................................................................................................... 7 6 MODES OF OPERATIONS ............................................................................................................. 8 6.1 Standalone (Push-Button) Mode .............................................................................................. 8 6.2 SPI Mode ................................................................................................................................. 8 7 TIMING DIAGRAMS ........................................................................................................................ 8 7.1 Basic Operation ........................................................................................................................ 8 7.2 SPI Operation ......................................................................................................................... 12 8 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 13 8.1 Operating Conditions ............................................................................................................. 13 9 ELECTRICAL CHARACTERISTICS ............................................................................................. 14 9.1 DC Parameters ...................................................................................................................... 14 9.2 AC Parameters ....................................................................................................................... 15 10 TYPICAL APPLICATION CIRCUITS ............................................................................................. 16 10.1 Good Audio Design Practices ................................................................................................ 18 11 PACKAGING .................................................................................................................................. 19 11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC .................... 19 11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) .......................................... 20 11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................ 21 12 ORDERING INFORMATION ......................................................................................................... 21 13 VERSION HISTORY ...................................................................................................................... 23 Publication Release Date:Feb 4, 2010 - 2 - Revision 2.0