Product Information

NIN-FA3R9JTR250F

NIN-FA3R9JTR250F electronic component of NIC

Datasheet
Ind Chip Molded Wirewound 3.9uH 5% 7.96MHz 30Q-Factor 250mA 1210 Embossed Plastic T/R

Manufacturer: NIC
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

2000: USD 0.0907 ea
Line Total: USD 181.4

0 - Global Stock
MOQ: 2000  Multiples: 2000
Pack Size: 2000
Availability Price Quantity
0 - Global Stock


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 2000
Multiples : 2000
2000 : USD 0.1094

     
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Molded Chip Wirewound Inductors NIN Series FEATURES EIA SIZES A (1210), B (1812), AND C (1008) EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS BOTH FLOW AND REFLOW SOLDERING APPLICABLE HIGH INDUCTANCE AVAILABLE IN SMALL SIZE EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE AVAILABLE TYPE AND SPECIFICATIONS Case Size Specifications NIN-xC (1008) NIN-xA (1210) NIN-xB (1812) NIN-Fx (Standard) Inductance Range 0.01 ~ 100H 0.01 ~ 470H 0.1 ~ 1000H NIN-Px (High Current) Inductance Range 1.0 ~ 33H 1.0 ~ 330H 1.0 ~ 680H Inductance Tolerances 20% (M), 10% (K), 5% (J) Operating Temperature Range -40C ~ +105C (Includes Self Heating) Insulation Resistance 1,000 MegOhm Min. ( 100Vdc, Termination to Case) Withstanding Voltage 250Vdc for 1 minute (Termination to Case) Q Factor, Self Resonant Frequency, DC Resistance, Rated DC Current See Individual Product Listings and Inductance Tolerance Note 1: NIN-N Family option are no longer recomennded for new designs. View announcment for more information Note 2: Extended values, tolerances, and enhanced versions are available please contact NIC for more details. DIMENSIONS (mm) EIA Size Size Code Dim. L Dim. W Dim. H Dim. A Dim. B 1008 C 2.5 0.2 2.0 0.2 1.8 0.2 1.4 0.1 0.4 typ. MARKING 1210 A 3.2 0.4 2.5 0.2 2.2 0.2 1.9 0.1 0.4 typ. 1812 B 4.5 0.4 3.2 0.2 3.2 0.2 1.2 0.2 1.0 typ. L PART MARKING Value Tolerance Case Size Example Marking Marking NIN-FC & PC No No N/A 1008 NIN-FA Yes Yes 3R3J 1210 NIN-PA B Yes No 470 1210 NIN-FB & PB Yes No 270 (1) 3 digits system in H (2) R indicates decimal point in H Ex:2R7 = 2.7H Ex:R18 = .18H = 180nH (3) N indicates nanohenries (0.001 H), Ex: 10N = 0.01 H = 10nH PART NUMBER SYSTEM* NIN-FA R47 M TR 450 F Lead Free/RoHS compliant Current Rating (mA) Packaging: TR = Tape & Reel Inductance Tolerance Code: M = 20%, K = 10%, J = 5% Rated inductance in H (3 digits, first 2 numbers are significant, R stands for decimal point) Series-Type *Part Number System updated to reflect new format and PCN. Older part number availability are subject to EOL/PCN . Please view announcment for more information. Please view archived datasheet for original part number specifications NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 1 Specifications are subject to change A W H AMolded Chip Wirewound Inductors NIN Series ENVIRONMENTAL CHARACTERISTICS Test Specification Test Method & Condition Solderability 90% Min. Coverage After 3 Sec. Dip in +230C Solder Pot (Post Flux) Humidity After 500 Hrs at +60C and 90~95% RH (1) No Evidence of Damage Soldering Effect After 5 Sec. at +260C (5 min. 120C Pre-Heat) (2) Inductance Shall Be Within Low Frequency Vibration 5% of Initial Value After 2 Hrs per Axis, 10 ~ 55Hz, 1.5mm Amplitude (3) Q Factor Shall Be Within Thermal Shock After 100 Cycles (-40C ~ +85C) 30 Min. Each 10% of Initial Value Low Temperature Storage After 500 Hrs at -25C High Temperature Load (1) No Evidence of Damage After 500 Hrs. at +85C with Rated DC Current Life (2) Inductance Shall Be Within 10% of Initial Value (3) Q Factor Shall Be Within After 500 Hrs at +60C with 90~95% RH Humidity Load Life 10% of Initial Value at Rated DC Current Applicable Guidelines: 1. Recommended soldering conditions : o o Flow (wave): 250 C for 5 sec. max. (preheating of 120 C for 5 minutes.) o Reflow: 250 C for 10 sec. max., total time above 230C is 40 sec. max. (preheating 150C ~ 180C/120 sec. max.) 2. Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems. 3. For mounting, it is suggested to secure chip inductor by means of epoxy adhesive curable by ultraviolet. 4. Ultrasonic cleaning is not recommended. If it is necessary, the cleaning conditions must be examined so as not to create mechanical damage by unexpected resonant vibration. Please contact our engineering department. 5. An excessive mechanical force may effect the electrical and magnetic properties of chip inductors. Make sure not to use any stress greater than 2Kg when component is placed. NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 2 Specifications are subject to change

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