Product Information

H14NG03-A12

H14NG03-A12 electronic component of NI-BOXING

Datasheet
DIP Power Modules ROHS
Manufacturer: NI-BOXING
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.5618 ea
Line Total: USD 4.56

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between
Fri. 17 May to Wed. 22 May

MOQ : 1
Multiples : 1

Stock Image

H14NG03-A12
NI-BOXING

1 : USD 2.2599
10 : USD 1.9954
52 : USD 1.953
104 : USD 1.8884

Read More Specifications

     
Manufacturer
Product Category
Category
Rohs
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Additional Infomation About Product

The H14NG03-A12 DIP Power module with ROHS manufactured by NI-BOXING is a highly efficient power module designed to meet the needs of consumer and commercial applications. The module is dual in-line package (DIP) designed with two 12-pin sections that allows for a wide variety of voltage and current requirements. The product is certified by the European E-Mark standard, which ensures that the product meets necessary safety standards in Europe. The module features a high efficiency of over 90% and low switch-on voltage. The module is manufactured using high quality electronic components and meets the RoHS (Restriction of Hazardous Substances) standards. The H14NG03-A12 Power Module is also designed to provide reliable performance and exceptional power throughput with no electromagnetic interference (EMI).

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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