74AUP1G74GD,125

74AUP1G74 Low-power D-type flip-flop with set and reset positive-edge trigger Rev. 9 6 January 2014 Product data sheet 1. General description The 74AUP1G74 provides a low-power, low-voltage single positive-edge triggered D-type flip-flop with individual data (D), clock (CP), set (SD) and reset (RD) inputs and complementary Q and Q outputs. The SD and RD are asynchronous active LOW inputs and operate independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire V range from 0.8 V to 3.6 V. CC This device ensures a very low static and dynamic power consumption across the entire V range from 0.8 V to 3.6 V. CC This device is fully specified for partial power-down applications using I . The I OFF OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity Complies with JEDEC standards: JESD8-12 (0.8 V to 1.3 V) JESD8-11 (0.9 V to 1.65 V) JESD8-7 (1.2 V to 1.95 V) JESD8-5 (1.8 V to 2.7 V) JESD8-B (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F Class 3A exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption I = 0.9 A (maximum) CC Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of V CC I circuitry provides partial power-down mode operation OFF Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C74AUP1G74 NXP Semiconductors Low-power D-type flip-flop with set and reset positive-edge trigger 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G74DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package 8 leads SOT765-1 body width 2.3 mm 74AUP1G74GT 40 C to +125 C XSON8 plastic extremely thin small outline package no leads SOT833-1 8 terminals body 1 1.95 0.5 mm 74AUP1G74GF 40 C to +125 C XSON8 extremely thin small outline package no leads SOT1089 8 terminals body 1.35 1 0.5 mm 74AUP1G74GD 40 Cto +125 C XSON8 plastic extremely thin small outline package no leads SOT996-2 8 terminals body 3 2 0.5 mm 74AUP1G74GM 40 C to +125 C XQFN8 plastic, extremely thin quad flat package no leads SOT902-2 8 terminals body 1.6 1.6 0.5 mm 74AUP1G74GN 40 C to +125 C XSON8 extremely thin small outline package no leads SOT1116 8 terminals body 1.2 1.0 0.35 mm 74AUP1G74GS 40 C to +125 C XSON8 extremely thin small outline package no leads SOT1203 8 terminals body 1.35 1.0 0.35 mm 4. Marking Table 2. Marking codes 1 Type number Marking code 74AUP1G74DC p74 74AUP1G74GT p74 74AUP1G74GF 54 74AUP1G74GD p74 74AUP1G74GM p74 74AUP1G74GN 54 74AUP1G74GS 54 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram SD SD D Q D Q CP S CP FF C1 Q Q 1D RD R RD 001aah725 001aah726 Fig 1. Logic symbol Fig 2. IEC logic symbol 74AUP1G74 All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Product data sheet Rev. 9 6 January 2014 2 of 28