SURFACE MOUNT MONOLITHIC CHIP CAPACITORS SURFACE MOUNT MONOLITHIC CHIP CAPACITORS COG AND TEMPERATURE COMPENSATING TYPES GRM36/39/40/42-6/42-2/43-2/44-1 Series FEATURES Miniature size No Polarity Nickel Barrier Termination Standard highly resistant to metal migration Uniform dimensions and configuration Suitable for reflow soldering GRM39, 40 and 42-6 suitable for wave soldering Minimum series inductance Tape and Reel Packaging Bulk Case Packaging available for GRM40 and smaller Wide selection of capacitance values and voltages Largest production capacity and volume in the world PART NUMBERING SYSTEM GRM40 COG 101 J 050 A D CAPACITOR 3-digit code TEMPERATURE CAPACITANCE VALUE CAPACITANCE VOLTAGE MARKING PACKAGING TYPE AND SIZE appears as CHARACTERISTICS Expressed in picofarads TOLERANCE Identified A = Unmarked See below and necessary COG and identified by a *= Standard by a following pages. to indicate COH three-digit number. 5pf: three-digit Reel Diameter/ special P2H First two digits B = .1pf number. Code Tape Material thickness R2H represent significant *C = .25pf requirements. S2H figures. Last digit >5pf to 10pf: 7 Paper Tape D Please consult T2H specifies the number B = .1pf 7 Plastic Tape L your local U2J of zeros to follow. C = .25pf 13 Paper Tape J sales office SL For fractional values *D = .5pf for details. below 10pF, the letter R >10pf: 13 Plastic Tape K is used as the decimal K = 10% Bulk B point and the last digit *J = 5% Bulk Cassette C becomes significant. G = 2% 7 Paper F= 1% Q 2mm pitch See pages 115 -118 for labeling and packaging information. CHIP DIMENSIONS EIA L W T e (min.) g (min.) Dimensions: mm Size Code Length Width Thickness Termination Insulation GRM36 0402 1.0 0.05 0.5 0.05 0.5 0.05 0.15 ~ 0.3 0.4 GRM39* 0603 1.6 0.1 0.8 0.1 0.8 0.1 0.2 ~ 0.5 0.5 0.6 0.1 g ee GRM40 0805 2.0 0.1 1.25 0.1 0.85 0.1 0.2 ~ 0.7 0.7 1.25 0.1 0.85 0.1 3.2 0.15 1.6 0.15 GRM42-6 1206 1.15 0.1 0.3 ~ 0.8 1.5 3.2 0.2 1.6 0.2 1.6 0.2 T 1.15 0.1 1.35 0.15 LW GRM42-2 1210 3.2 0.3 2.5 0.2 0.3 min. 1.0 1.8 0.2 2.5 0.2 GRM43-2 1812 4.5 0.4 3.2 0.3 2.0 max. 0.3 min. 2.0 GRM44-1 2220 5.7 0.4 5.0 0.4 2.0 max. 0.3 min. 2.0 *Bulk case packaging is L = 1.6 0.07, W, T = 0.8 0.07. CHIP TERMINATION DIAGRAMS Nickel Barrier Layer (Standard) GRM Series Ceramic Dielectric Inner Electrode Inner Termination (Ag or Ag/Pd or Cu) Nickel Plated Barrier Layer Tin Plating* *Size 0402 Solder Plated All products on this page are available as standard through authorized Murata Electronics Distributors. CG01-J 7SURFACE MOUNT MONOLITHIC CHIP CAPACITORS COG AND TEMPERATURE COMPENSATING TYPES GRM36/39/40/42-6/42-2/43-2/44-1 Series SPECIFICATION GENERAL ELECTRICAL TEST Temperature Coefficient Temperature Range Capacitance & Q 1000pF 1MHz 100Hz 1.0 .2 Vrms C0G = 0 30 ppm* 55 to +125C (Frequency & Voltage): >1000pF 1kHz 100Hz 1.0 .2 Vrms C0H = 0 60 ppm 55 to +125C 30pF: 400 + (20xC (pF)) P2H = N150 60 ppm 55 to +85C Q Limits >30pF: 1000 minimum R2H = N220 60 ppm 55 to +85C S2H = N330 60 ppm 55 to +85C 100,000 megohms or 1000 megohms mfd Insulation Resistance (whichever is less) with rated voltage applied T2H = N470 60 ppm 55 to +85C (I.R.) for 2 minutes max with 50mA limiting current U2J = N750 120 ppm 55 to +85C SL = N1000 to P350 55 to +85C 250% of rated voltage for 5 seconds with series Dielectric Strength resistor limiting charging current to 50mA max. (Flash) 200% for 500V *TC Tolerance for COG Refer to EIA-RS198E for other limitations Aging Negligible MECHANICAL TEST TEST METHOD POST TEST LIMITS 0603 1.0 lbs. Terminal 0805 2.2 lbs. Adhesion Glass Epoxy Board No evidence of termination peeling 10 Mounting 2n Load 1mm deflection (Glass epoxy board) Capacitor R340 Deflection Deflection No mechanical damage Cap., DF, IR meet initial limits Unit: mm 45 45 Capacitance meter Supporter MIL-STD-202 Contact factory for Solderability Method 208F test limits ENVIRONMENTAL TEST TEST METHOD POST TEST LIMITS MIL-STD-202, Method 107, Condition A Appearance: No visual damage Thermal C: = 2.0% or 0.5pF (whichever is greater) Shock Post thermal Shock measurement shall be taken after 24 hours Q: >30pF = 1,000 min., 30pF = 400 + 20 x C(pF) (Air to Air) stabilization. I.R.: = 100,000M min. or 1,000M F (whichever is less) Appearance: No defects Maintain the capacitor at 40 2C and 90 to 95% humidity for Capacitance: Within 5% or .0.5pF (whichever is greater) Humidity, 500 12 hours. Remove and let sit for 24 2 hours at room Q/D.F.: 30pF and over: Q350 10pf to 30pf: Q275+5/2C Steady State temperature, then measure. Q/D.F.: 10pf and below: Q20010C I.R.: 1,000M or 50M F (whichever is less) C: Nominal Capacitance (pF) Appearance: No defects Apply the rated voltage at 40 2C and 90 to 95% humidity for Capacitance: Within 7.5% or .0.75pF (whichever is greater) Humidity Load 500 12 hours. Remove and let sit for 24 2 hours at room Q/D.F.: 30pF and over: Q200 temperature, then measure. The charge/discharge current is Q/D.F.: 30pf and below: Q10010/3C . less than 50mA. I.R.: 500M or 25M F (whichever is less) C: Nominal Capacitance (pF) Apply 200% of rated voltage for 1000 12 hours at Appearance: No defects maximum operating temperature 150% for 500V. Capacitance: 3% or .3pF (whichever is greater) Life Test Q: >30pF = 500 min., 30pF = 200 + 10 x C(pF) Upon completion of above test wait 24 hours prior I.R.: 1,000M or 50M F (whichever is less) to performing post testing. Flash: 250% rated voltage STORAGE LIFE Chip component terminations should 1. All chip components, including 3. The solderability of the chip tape and reel, should be kept in components should be rechecked generally be protected from moisture. an area where the temperature in the event that they are not used In addition, they should also be is between 5C and 40C and in six months. protected from materials containing where the humidity is 20% to 70%. chlorine, sulfur compounds or any 4. Peel strength and shelf life of tape harmful gases that could cause 2. The chip components should be are guaranteed for 1 year when degradation of the solder. used within six months. stored under afore said conditions. 8 CG01-J