Product Information

PM75RL1A060

PM75RL1A060 electronic component of Mitsubishi

Datasheet
Gate Drivers IPM MODULE L1-SERIES

Manufacturer: Mitsubishi
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 124.3577 ea
Line Total: USD 124.36

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 13 May to Wed. 15 May


Multiples : 10

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PM75RL1A060
Mitsubishi


0 - WHS 2


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 1
Multiples : 1

Stock Image

PM75RL1A060
Mitsubishi

1 : USD 124.3577

     
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POWER MODULES POWER MODULES Mitsubishi Electric Semiconductors & Devices Website www.MitsubishiElectric.com/semiconductors/ Power Modules Revised publication, effective Apr. 2019. Superseding publication of H-CT575-C Out. 2018. Specifications subject to change without notice. 2019 H-CT575-D FU-1904 Printed in Japan <IP>Focus Technology InnovativePowerDevices 7th-Generation 1,200V-Class IGBT Chip Technology Cutting-edge technology realizes energy-saving inverter devices foraSustainableFuture Latest thin-wafer processing (n-drift layer) achieves thinner wafer than 6th-generation 1200V-class IGBT structure Comparison of power loss devices Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global 6th-gen. IGBT 7th-gen. IGBT G G Performance improved by combining E E E E environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are 4th-gen. TM CSTBT * and light punch-through (LPT) photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of structures n-drift layer n-drift layer 5th-gen. Inverter system power dissipation mini- power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, 6th-gen. n buer mized by its superior performance(lower p collector 7th-gen. and home appliances that achieve ground-breaking energy savings. Whether in appliances, railcars, EVs or industrial The latest VCEsat and Eoff) p collector n buer thin wafer process TM systems, our power modules are key elements in changing the way energy is used. *CSTBT : Mitsubishi Electrics unique IGBT that makes Optimize wafer thickness use of carrier cumulative effect Improve performance A small surface mount pakage IPM has been newly developed TM MISOP for fan and low-power motor drive applications Surface mount package IPM Key Features Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size Wind power generation Newly integrated interlock function in addition to conventional protection features for robust operation TM Bootstrap diode is integrated for the P-side drive power supply like conventional DIPIPM series, Household electrical reducing the number of peripheral external parts appliances Inverters Induction heating Energy cooking stoves Creation Modules realizing single-control power supply and photocoupler-less TM DIPIPM systems for household appliances and low-capacity inverters Key Features Transfer-molded structure incorporating a high thermal conductivity insulation sheet provides heat High-voltage IC equipped with drive, protection and level-shift circuits for direct control via input Smart grid Photovoltaic power signals from a CPU or microcomputer generation Compact board and highly reliable equipment realized through single power-supply and photocoupler-less systems Effective use of energy Includes built-in bootstrap diode (BSD) Electric/ Hybrid vehicles Modules with built-in control and protection circuits for AC servo robots IPM Intelligent Power Modules and PV power generation Industrial robots Motors Key Features Built-in protection circuits for short-circuiting, power supply undervoltage and overheating Highly compatible package with simplified printed circuit board (PCB) design Special intelligent power modules (IPMs) for power conditioners in PV power generation Traction systems IGBT modules for general-purpose inverters used in various applications IGBT Modules Insulated Gate Bipolar Key Features Transistor Modules Various low-inductance packages and power chips available Compatible with high-frequency, high-voltage (1,700V) applications Large-capacity modules available for renewable energy systems High voltage, large capacity and high reliability are realized for HVIGBT Modules High-Voltage Insulated Gate Bipolar traction and power transmission application Transistor Modules Key Features Two types of package are realized:std typ with large output power anddual typ for various inverter capacity by easy parallel connection The abundant field experience more than 20 years especially in the application of bullet train High reliability due to a long lifetime design and a robust design against severe environment Modules realizing high performance and reliability for propulsion Power Modules for Vehicles inverters in HVs/EVs Power Modules for EV/PHEV Key Features Built-in temperature analog output function realizing highly reliable drive train High-power/temperature cycle life ensures high reliability Compliant with the End-of-life Vehicles Directive, regulations relating to substances of environmental concern High traceability in managing materials/components throughout the entire production process for each product HV: Hybrid Vehicle EV Electric Vehicle PHEV Plug-in Hybrid Electric Vehicle 1 2

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
MITSUBISHI (UNI-BALL)
Mitsubishi Electric
Mitsubishi Semiconductor

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