256Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC64M4A2 16 Meg x 4 x 4 banks MT48LC32M8A2 8 Meg x 8 x 4 banks MT48LC16M16A2 4 Meg x 16 x 4 banks Options Marking Features 60-ball FBGA (x4, x8) (8mm x 16mm) FB PC100- and PC133-compliant 60-ball FBGA (x4, x8) (8mm x 16mm) BB Fully synchronous all signals registered on positive Pb-free edge of system clock 2 54-ball VFBGA (x16) (8mm x 14 mm) FG Internal, pipelined operation column address can 2 54-ball VFBGA (x16) (8mm x 14 mm) BG be changed every clock cycle Pb-free Internal banks for hiding row access/precharge 3 54-ball VFBGA (x16) (8mm x 8 mm) F4 Programmable burst lengths: 1, 2, 4, 8, or full page 3 54-ball VFBGA (x16) (8mm x 8 mm) B4 Auto precharge, includes concurrent auto precharge Pb-free and auto refresh modes Timing cycle time Self refresh mode (not available on AT devices) 6ns CL = 3 (x8, x16 only) -6A Auto refresh 2 7.5ns CL = 3 (PC133) -75 64ms, 8192-cycle refresh (commercial and 7.5ns CL = 2 (PC133) -7E industrial) Self refresh 16ms, 8192-cycle refresh (automotive) Standard None LVTTL-compatible inputs and outputs 2 4 Low power L , Single 3.3V 0.3V power supply Operating temperature range Commercial (0C to +70C) None Options Marking Industrial (40C to +85C) IT Configurations 4 Automotive (40C to +105C) AT 64 Meg x 4 (16 Meg x 4 x 4 banks) 64M4 Revision :D/:G 32 Meg x 8 (8 Meg x 8 x 4 banks) 32M8 16 Meg x 16 (4 Meg x 16 x 4 banks) 16M16 1. Off-center parting line. Notes: t Write recovery ( WR) 2. Only available on Revision D. t WR = 2 CLK A2 3. Only available on Revision G. 1 Plastic package OCPL 4. Contact Micron for availability. 1 54-pin TSOP II OCPL (400 mil) TG (standard) 1 54-pin TSOP II OCPL (400 mil) P Pb-free Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -6A 167 3-3-3 18 18 18 -75 133 3-3-3 20 20 20 -7E 133 2-2-2 15 15 15 PDF: 09005aef8091e6d1 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 256Mb sdr.pdf - Rev. R 10/12 EN 1999 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.256Mb: x4, x8, x16 SDRAM Features Table 2: Address Table Parameter 64 Meg x 4 32 Meg x 8 16 Meg x 16 Configuration 16 Meg x 4 x 4 banks 8 Meg x 8 x 4 banks 4 Meg x 16 x 4 banks Refresh count 8K 8K 8K Row addressing 8K A 12:0 8K A 12:0 8K A 12:0 Bank addressing 4 BA 1:0 4 BA 1:0 4 BA 1:0 Column addressing 2K A 9:0 , A11 1K A 9:0 512 A 8:0 Table 3: 256Mb SDR Part Numbering Part Numbers Architecture Package MT48LC64M4A2TG 64 Meg x 4 54-pin TSOP II MT48LC64M4A2P 64 Meg x 4 54-pin TSOP II 1 MT48LC64M4A2FB 64 Meg x 4 60-ball FBGA 1 MT48LC64M4A2BB 64 Meg x 4 60-ball FBGA MT48LC32M8A2TG 32 Meg x 8 54-pin TSOP II MT48LC32M8A2P 32 Meg x 8 54-pin TSOP II 1 MT48LC32M8A2FB 32 Meg x 8 60-ball FBGA 1 MT48LC32M8A2BB 32 Meg x 8 60-ball FBGA MT48LC16M16A2TG 16 Meg x 16 54-pin TSOP II MT48LC16M16A2P 16 Meg x 16 54-pin TSOP II MT48LC16M16A2FG 16 Meg x 16 54-ball FBGA MT48LC16M16A2BG 16 Meg x 16 54-ball FBGA Note: 1. FBGA Device Decoder: www.micron.com/decoder. PDF: 09005aef8091e6d1 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 256Mb sdr.pdf - Rev. R 10/12 EN 1999 Micron Technology, Inc. All rights reserved.