Product Information

TP5335K1-G

TP5335K1-G electronic component of Microchip

Datasheet
Transistor: P-MOSFET; unipolar; -350V; -0.4A; 360mW; SOT23-3

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

500: USD 0.6592 ea
Line Total: USD 329.6

2910 - Global Stock
Ships to you between
Mon. 20 May to Fri. 24 May
MOQ: 500  Multiples: 500
Pack Size: 500
Availability Price Quantity
2910 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 500
Multiples : 500

Stock Image

TP5335K1-G
Microchip

500 : USD 0.6592
1000 : USD 0.6301
3000 : USD 0.5565
6000 : USD 0.5481
9000 : USD 0.5358
12000 : USD 0.5276
15000 : USD 0.5197
27000 : USD 0.512

1742 - WHS 2


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1

Stock Image

TP5335K1-G
Microchip

1 : USD 0.7242
10 : USD 0.7107
25 : USD 0.697
100 : USD 0.6836
250 : USD 0.6699
500 : USD 0.6699
1000 : USD 0.6699

20370 - WHS 3


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 3000
Multiples : 3000

Stock Image

TP5335K1-G
Microchip

3000 : USD 0.6245

20074 - WHS 4


Ships to you between Fri. 24 May to Tue. 28 May

MOQ : 1
Multiples : 1

Stock Image

TP5335K1-G
Microchip

1 : USD 0.6451
25 : USD 0.5577
100 : USD 0.5129

     
Manufacturer
Product Category
Kind Of Channel
Case
Mounting
Polarisation
Type Of Transistor
Drain-Source Voltage
On-State Resistance
Gate-Source Voltage
Pulsed Drain Current
Power Dissipation
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TP5335 P-Channel Enhancement-Mode Vertical DMOS FET Features General Description High Input Impedance and High Gain The TP5335 is a low-threshold, Enhancement-mode (normally-off) transistor that utilizes an advanced Low Power Drive Requirement vertical DMOS structure and a well-proven silicon gate Ease of Paralleling manufacturing process. This combination produces a Low C and Fast Switching Speeds ISS device with the power handling capabilities of bipolar Excellent Thermal Stability transistors and the high input impedance and positive Integral Source-Drain Diode temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free Free from Secondary Breakdown from thermal runaway and thermally induced secondary breakdown. Applications Microchips vertical DMOS FETs are ideally suited to a Logic-Level Interfaces (Ideal for TTL and CMOS) wide range of switching and amplifying applications Solid-State Relays where high breakdown voltage, high input impedance, Analog Switches low input capacitance, and fast switching speeds are desired. Power Management Telecommunication Switches Package Type 3-lead SOT-23 (Top view) DRAIN SOURCE GATE See Table 2-1 for pin information. 2018-2020 Microchip Technology Inc. DS20005704C-page 1TP5335 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Drain-to-Source Voltage....................................................................................................................................... BV DSS Drain-to-Gate Voltage .......................................................................................................................................... BV DGS Gate-to-Source Voltage.......................................................................................................................................... 20V Junction Temperature, T .................................................................................................................... 55C to +150C J Storage Temperature, T ...................................................................................................................... 55C to +150C S Notice: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS COMMERCIAL Electrical Specifications: T = T = 25C unless otherwise specified. All DC parameters are 100% tested at 25C A J unless otherwise stated. (Pulse test: 300 s pulse, 2% duty cycle.) Parameter Sym. Min. Typ. Max. Unit Conditions Drain-to-Source Breakdown BV 350 V V = 0V, I = 100 A DSS GS D Voltage Gate Threshold Voltage V 1 2.4 V V = V , I = 1 mA GS(th) DS GS D Change in V GS(th) V 4.5 mV/C V = V , I = 1 mA (Note 1) GS(th) DS GS D with Temperature Gate Body Leakage I 100 nA V = 20V, V = 0V GSS GS DS V = Maximum rating, DS 10 A V = 0V GS Zero-Gate Voltage Drain Current I DSS V = Maximum rating, DS 1 mA V = 0V, T = 125C (Note 1) GS A 200 mA V = 4.5V, V = 25V GS DS On-State Drain Current I D(ON) 400 mA V = 10V, V = 25V GS DS 75 V = 4.5V, I = 150 mA Static Drain-to-Source On-State GS D R DS(ON) Resistance 30 V = 10V, I = 200 mA GS D Change in R with V = 10V, I = 200 mA DS(ON) GS D 1.7 %/C RDS(ON) Temperature (Note 1) Note 1: Specification is obtained by characterization and is not 100% tested. DC ELECTRICAL CHARACTERISTICS AUTOMOTIVE Electrical Specifications: T = T = (55C, 25C, or 150C) unless otherwise specified. All DC parameters are A J 100% tested at all three temperatures unless otherwise stated. (Pulse test: 300 s pulse, 2% duty cycle.) Parameter Sym. Min. Typ. Max. Unit Conditions Drain-to-Source Breakdown BV 350 V V = 0V, I = 100 A DSS GS D Voltage Gate Threshold Voltage V 1 2.4 V V = V , I = 1 mA GS(th) DS GS D Change in V GS(th) V 3.3 mV/C V = V , I = 1 mA (Note 1) GS(th) DS GS D with Temperature 100 nA V = 20V, V = 0V GS DS Gate Body Leakage I V = 20V, V = 0V, GSS GS DS 220 nA T = 150C A Note 1: Specification is obtained by characterization and is not 100% tested. DS20005704C-page 2 2018-2020 Microchip Technology Inc.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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