Product Information

MSMCJ100CA/TR

MSMCJ100CA/TR electronic component of Microchip

Datasheet
ESD Suppressors TVS Diodes
Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

400: USD 3.0308 ea
Line Total: USD 1212.32

0 - Global Stock
MOQ: 400  Multiples: 400
Pack Size: 400

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Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 22 May to Fri. 24 May

MOQ : 400
Multiples : 400

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MSMCJ100CA/TR
Microchip

400 : USD 3.0308

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product Type
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Ipp - Peak Pulse Current
Package / Case
Pppm - Peak Pulse Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Current Rating
Brand
Pd - Power Dissipation
Factory Pack Quantity :
Subcategory
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Additional Infomation About Product

MSMCG5.0A MXLSMCG170CAe3, MSMCJ5.0 MXLSMCJ170CAe3 Screening in Surface Mount 1500 Watt reference to Available MIL-PRF-19500 Transient Voltage Suppressor available DESCRIPTION The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. The SMCG gull- wing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend design in the DO-214AB package allows for greater PC board mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are available with a variety of upscreening options for enhanced reliability. They can protect against the secondary DO-215AB effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching environments and induced by RF radiation. Since their response time is virtually instantaneous, (SMCG) Package they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. Important: For the latest information, visit our website MSMCG5.0A MXLSMCG170CAe3, MSMCJ5.0 MXLSMCJ170CAe3 MAXIMUM RATINGS Parameters/Test Conditions Symbol Value Unit Junction and Storage Temperature TJ and TSTG -65 to +150 C Thermal Resistance Junction-to-Lead R 20 C/W JL (1) Thermal Resistance Junction-to-Ambient R 80 C/W JA P 1500 W Peak Pulse Power Dissipation 25 C (at 10/1000 s, PP see Figures 1, 2, and 3) Impulse Repetition Rate (duty factor) df 0.01 % tclamping (0 volts to V(BR) min.) Unidirectional tclamping <100 ps Bidirectional <5 ns Rated Average Power Dissipation TL = +30 C PM(AV) 6 W (1) T = +25 C 1.56 A (2) Maximum Forward Surge Current I 200 A (pk) FSM o Solder Temperature 10 s T 260 C SP Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page). 2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only). MECHANICAL and PACKAGING CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026. MARKING: Part number marked on package. POLARITY: Cathode indicated by band. No cathode band on bi-directional devices. TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add TR suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.25 grams. See Package Dimensions on last page. PART NOMENCLATURE MX SM C G 5.0 C A e3 Reliability Level* RoHS Compliance M e3 = RoHS Compliant MA Blank = non-RoHS Compliant MX MXL +/- 5% Tolerance Level *(see High Reliability Up-Screened Plastic Uni/Bidirectional Products Portfolio) C = Bidirectional Blank = Unidirectional Surface Mount Package Reverse Stand-Off Voltage (see Electrical Characteristics 1500 W Power Level table) Gull-wing Lead Frame G = Gull-Wing J = J-Bend RF01001, Rev. B (22/2/18) 2018 Microsemi Corporation Page 2 of 7

HS Compliance

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS

Microchip may also be referenced as

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Atmel
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M4S
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MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
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Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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