Product Information

MPLAD30KP280AE3

MPLAD30KP280AE3 electronic component of Microchip

Datasheet
ESD Suppressors / TVS Diodes Bi-Directional TVS

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

25: USD 28.5987 ea
Line Total: USD 714.97

0 - Global Stock
MOQ: 25  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 16 May to Wed. 22 May

MOQ : 25
Multiples : 1

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MPLAD30KP280AE3
Microchip

25 : USD 28.5987
250 : USD 26.9057

     
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RoHS - XON
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MPLAD30KP14A MPLAD30KP400CA High-Reliability Surface Mount 30,000 Watt Transient screening available in Available reference to Voltage Suppressor MIL-PRF-19500 DESCRIPTION These high power 30 kW rated transient voltage suppressors in a surface mount package are provided with design features to minimize thermal resistance and cumulative heating. Typical applications include lightning and automotive load dump protection. They are particularly effective at meeting the multi-stroke lightning standard RTCA DO-160, section 22 for aircraft design. This efficient low profile package design is offered in standoff voltage selections (V ) of 14 volts to WM 400 volts in either unidirectional or bidirectional construction. Important: For the latest information, visit our website MPLAD30KP14A MPLAD30KP400CA o MAXIMUM RATINGS @ 25 C unless otherwise specified Parameters/Test Conditions Symbol Value Unit Junction and Storage Temperature T and T -55 to +150 C/W J STG (1) Thermal Resistance Junction-to-Ambient R 50 C/W JA Thermal Resistance Junction-to-Case R 1.0 C/W JC (2) P 30,000 W Peak Pulse Power @ 10/1000 s PP Unidirectional <100 ps t (0 volts to V min) clamping ( BR) Bidirectional <5 ns (3) Forward Clamping Voltage @ 500 Amps V 4.0 V FS (3) Forward Surge Current I 1500 A FSM Solder Temperature @ 10 s T 260 C SP (5) (1) Steady-State Power dissipation T = 25 C P 2.5 W A D (4) T = 100 C 50 W C Notes: 1. When mounted on FR4 PC board with recommended mounting pad (see pad layout). 2. Also see figures 1 and 2. With impulse repetition rate (duty factor) of 0.05% or less. 3. At 8.3 ms half-sine wave (unidirectional devices only). 4. Case temperature controlled on heat sink as specified. 5. See MicroNote 134 for derating P when also applying steady-state power. PP MECHANICAL and PACKAGING CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL-STD-750, method 2026 MARKING: Body marked with part number POLARITY: For unidirectional devices, the cathode is on the metal backside (package bottom) Available in bulk or custom tape-and-reel packaging TAPE-AND-REEL: Standard per EIA-481-B (add TR suffix to part number). Consult factory for quantities. WEIGHT: Approximately 1.7 2.0 grams See Package Dimensions on last page. PART NOMENCLATURE M PLAD 30K P 14 CA (e3) Reliability Level* RoHS Compliance M e3 = RoHS compliant MA Blank = non-RoHS compliant MX MXL Polarity *(see Hirel Non-Hermetic A = Unidirectional Product Portfolio) CA = Bidirectional Package Designation Reverse Standoff Voltage P Rating (W) Plastic PP SYMBOLS & DEFINITIONS RF01005, Rev G (5/16/14) 2013 Microsemi Corporation Page 2 of 6

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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