MCP6052T-ESN

MCP6051/2/4 30 A, High Precision Op Amps Features Description Low Offset Voltage: 150 V (maximum) The Microchip Technology Inc. MCP6051/2/4 family of operational amplifiers (op amps) has low input offset Low Quiescent Current: 30 A (typical) voltage (150 V, maximum) and rail-to-rail input and Rail-to-Rail Input and Output output operation. This family is unity gain stable and Wide Supply Voltage Range: 1.8V to 6.0V has a gain bandwidth product of 385kHz (typical). Gain Bandwidth Product: 385 kHz (typical) These devices operate with a single supply voltage as Unity Gain Stable low as 1.8V, while drawing low quiescent current per Extended Temperature Range: -40C to +125C amplifier (30 A, typical). These features make the family of op amps well suited for single-supply, high No Phase Reversal precision, battery-powered applications. The MCP6051/2/4 family is offered in single Applications (MCP6051), dual (MCP6052), and quad (MCP6054) Automotive configurations. Portable Instrumentation The MCP6051/2/4 is designed with Microchips Sensor Conditioning advanced CMOS process. All devices are available in Battery Powered Systems the extended temperature range, with a power supply range of 1.8V to 6.0V. Medical Instrumentation Test Equipment Package Types Analog Filters MCP6051 MCP6052 Design Aids SOIC SOIC NC V 1 8 1 8 NC V DD OUTA SPICE Macro Models 2 7 V 2 7 V V DD V OUTB IN INA FilterLab Software V + 3 6 V V + 3 6 V IN OUT INA INB Microchip Advanced Part Selector (MAPS) NC V + V 4 5 V 4 5 INB SS SS Analog Demonstration and Evaluation Boards Application Notes MCP6051 MCP6052 2x3 TDFN * 2x3 TDFN * Typical Application NC V 1 8 NC 1 8 V OUTA DD V V V V IN 2 7 DD INA 2 7 OUTB EP EP 9 9 V + V V + V R IN 3 6 OUT INA 3 6 INB L 4 5 4 5 V NC V V + SS SS INB V OUT Z IN MCP6051 MCP6051 MCP6054 SOT-23-5 SOIC, TSSOP V V 1 14 OUTD V OUTA C 1 5 V OUT DD V 2 13 V IND V 2 INA SS Z = R +jL R IN L V + V + 3 12 V IND V + INA 3 4 IN IN Gyrator LR= RC V V 4 11 SS L DD V + V + 5 10 INC INB V V 6 9 INB INC V V 7 8 OUTC OUTB * Includes Exposed Thermal Pad (EP) see Table 3-1. 2010 Microchip Technology Inc. DS22182B-page 1MCP6051/2/4 NOTES: DS22182B-page 2 2010 Microchip Technology Inc.