Product Information

ATMEGA169PV-8AUR

ATMEGA169PV-8AUR electronic component of Microchip

Datasheet
8-bit Microcontrollers - MCU AVR LCD 16KB FLSH EE 512B 1KB SRAM-8MHZ

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1000: USD 6.5145 ea
Line Total: USD 6514.5

96030 - Global Stock
Ships to you between
Fri. 03 May to Thu. 09 May
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
300 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1
1 : USD 7.6587
10 : USD 7.55
25 : USD 7.399
100 : USD 7.399
250 : USD 7.399

300 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1
1 : USD 7.6587
10 : USD 7.55
25 : USD 7.399

96030 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1000
Multiples : 1000
1000 : USD 6.5145

     
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Features High Performance, Low Power Atmel AVR 8-Bit Microcontroller Advanced RISC Architecture 130 Powerful Instructions Most Single Clock Cycle Execution 32 8 General Purpose Working Registers Fully Static Operation Up to 16 MIPS Throughput at 16 MHz On-Chip 2-cycle Multiplier High Endurance Non-volatile Memory segments 16 Kbytes of In-System Self-programmable Flash program memory 512 Bytes EEPROM 1 Kbytes Internal SRAM 8-bit Write/Erase cycles: 10,000 Flash/100,000 EEPROM (1) Data retention: 20 years at 85C/100 years at 25C Microcontroller Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation with 16K Bytes Programming Lock for Software Security JTAG (IEEE std. 1149.1 compliant) Interface In-System Boundary-scan Capabilities According to the JTAG Standard Extensive On-chip Debug Support Programmable Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface Peripheral Features 4 25 Segment LCD Driver Flash Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode Real Time Counter with Separate Oscillator ATmega169P Four PWM Channels 8-channel, 10-bit ADC Programmable Serial USART ATmega169PV Master/Slave SPI Serial Interface Universal Serial Interface with Start Condition Detector Programmable Watchdog Timer with Separate On-chip Oscillator On-chip Analog Comparator Interrupt and Wake-up on Pin Change Special Microcontroller Features Power-on Reset and Programmable Brown-out Detection Preliminary Internal Calibrated Oscillator External and Internal Interrupt Sources Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby I/O and Packages 54 Programmable I/O Lines 64-lead TQFP, 64-pad QFN/MLF and 64-pad DRQFN Speed Grade: ATmega169PV: 0 - 4 MHz 1.8V - 5.5V, 0 - 8 MHz 2.7V - 5.5V ATmega169P: 0 - 8 MHz 2.7V - 5.5V, 0 - 16 MHz 4.5V - 5.5V Temperature range: -40C to 85C Industrial Ultra-Low Power Consumption Active Mode: 1 MHz, 1.8V: 330 A 32 kHz, 1.8V: 10 A (including Oscillator) 32 kHz, 1.8V: 25 A (including Oscillator and LCD) Power-down Mode: 0.1 A at 1.8V Power-save Mode: 0.6 A at 1.8V (Including 32 kHz RTC) Rev. 8018PAVR08/10ATmega169P 1. Pin Configurations 1.1 Pinout - TQFP/QFN/MLF Figure 1-1. 64A (TQFP) and 64M1 (QFN/MLF) Pinout ATmega169P PA3 (COM3) LCDCAP 1 48 (RXD/PCINT0) PE0 2 PA4 (SEG0) 47 INDEX CORNER (TXD/PCINT1) PE1 3 PA5 (SEG1) 46 PA6 (SEG2) (XCK/AIN0/PCINT2) PE2 4 45 (AIN1/PCINT3) PE3 5 PA7 (SEG3) 44 (USCK/SCL/PCINT4) PE4 6 43 PG2 (SEG4) (DI/SDA/PCINT5) PE5 7 42 PC7 (SEG5) (DO/PCINT6) PE6 8 41 PC6 (SEG6) (CLKO/PCINT7) PE7 9 40 PC5 (SEG7) (SS/PCINT8) PB0 10 39 PC4 (SEG8) (SCK/PCINT9) PB1 11 PC3 (SEG9) 38 PC2 (SEG10) (MOSI/PCINT10) PB2 12 37 (MISO/PCINT11) PB3 PC1 (SEG11) 13 36 PC0 (SEG12) (OC0A/PCINT12) PB4 14 35 (OC1A/PCINT13) PB5 15 34 PG1 (SEG13) (OC1B/PCINT14) PB6 16 33 PG0 (SEG14) Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be sol- dered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 2 8018PAVR08/10 17 64 (OC2A/PCINT15) PB7 AVCC 18 63 (T1/SEG24) PG3 GND 19 62 AREF (T0/SEG23) PG4 RESET/PG5 20 61 PF0 (ADC0) 21 60 PF1 (ADC1) VCC GND 22 PF2 (ADC2) 59 (TOSC2) XTAL2 23 PF3 (ADC3) 58 24 (TOSC1) XTAL1 PF4 (ADC4/TCK) 57 25 (ICP1/SEG22) PD0 PF5 (ADC5/TMS) 56 26 (INT0/SEG21) PD1 PF6 (ADC6/TDO) 55 27 (SEG20) PD2 PF7 (ADC7/TDI) 54 28 GND (SEG19) PD3 53 (SEG18) PD4 29 52 VCC (SEG17) PD5 51 PA0 (COM0) 30 (SEG16) PD6 50 PA1 (COM1) 31 (SEG15) PD7 49 PA2 (COM2) 32

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

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