Product Information

1N5711UR-1

1N5711UR-1 electronic component of Microchip

Datasheet
Schottky Diodes & Rectifiers Schottky

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

87: USD 8.4586 ea
Line Total: USD 735.9

0 - Global Stock
MOQ: 87  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 87
Multiples : 1

Stock Image

1N5711UR-1
Microchip

87 : USD 8.4586
870 : USD 8.1161
8700 : USD 7.9537

0 - WHS 2


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

1N5711UR-1
Microchip

1 : USD 11.72

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Mounting Style
Package / Case
Configuration
Technology
If - Forward Current
Vrrm - Repetitive Reverse Voltage
Vf - Forward Voltage
Ir - Reverse Current
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
LoadingGif

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1N5711UR-1, 1N5712UR-1, 1N6857UR-1, and 1N6858UR-1 plus CDLL equivalents Qualified Levels: Schottky Barrier Diode JAN, JANTX, and Available on JANTXV commercial MELF Surface Mount versions Qualified per MIL-PRF-19500/444 DESCRIPTION This Schottky barrier diode is metallurgically bonded and offers military grade qualifications for high-reliability applications. This small diode is hermetically sealed and bonded into a DO-213AA glass package. Also included in this datasheet are Microsemis CDLL numbered variants of this series (military qualification grades not are not available for the CDLL prefix part numbers). DO-213AA (MELF) Package Important: For the latest information, visit our website 1N5711UR-1, 1N5712UR-1, 1N6857UR-1, and 1N6858UR-1 plus CDLL equivalents MECHANICAL and PACKAGING CASE: Hermetically sealed glass DO-213AA MELF (SOD-80, LL34) case package. TERMINALS: Tin/lead plated or RoHS compliant matte-tin (on commercial grade only) over copper clad steel. Solderable per MIL-STD-750, method 2026. POLARITY: Cathode end is banded. MOUNTING: The axial coefficient of expansion (COE) of this device is approximately +6PPM/C. The COE of the mounting surface system should be selected to provide a suitable match with this device. MARKING: Part number. TAPE & REEL option: Standard per EIA-296. Consult factory for quantities. WEIGHT: Approximately 0.2 grams. See Package Dimensions on last page. PART NOMENCLATURE JAN 1N5711 UR -1 (e3) Reliability Level RoHS Compliance JAN = JAN level e3 = RoHS compliant (on JANTX = JANTX level commercial grade only) JANTXV = JANTXV level Blank = non-RoHS compliant Blank = Commercial grade Metallurgically Bonded JEDEC type number (see Electrical Characteristics MELF Surface Mount table) CDLL 2810 (e3) Microsemi Designation RoHS Compliance e3 = RoHS compliant Series number Blank = non-RoHS compliant (see Electrical Characteristics table) SYMBOLS & DEFINITIONS Symbol Definition C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage. f frequency I Reverse Current: The dc current flowing from the external circuit into the cathode terminal at the specified voltage V . R R Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave I O input and a 180 degree conduction angle. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from t rr the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. V (BR) Breakdown Voltage: A voltage in the breakdown region. V F Forward Voltage: A positive dc anode-cathode voltage the device will exhibit at a specified forward current. V Reverse Voltage: A positive dc cathode-anode voltage below the breakdown region. R Working Peak Reverse Voltage: The peak voltage excluding all transient voltages (ref JESD282-B). Also sometimes V RWM known historically as PIV. T4-LDS-0040-1, Rev. 1 (6/4/13) 2013 Microsemi Corporation Page 2 of 7

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