MLX75023RTF-BAA-001-SP

MLX75023 Time-of-Flight Sensor Array Product Datasheet Features & Benefits Description 1/3 optical Time-of-Flight sensor MLX75023 is a fully integrated optical time-of-flight 2 (optical area = 4.8 x 3.6 mm ) (TOF) camera sensor. Potential use cases include QVGA resolution, 320 x 240 pixels gesture recognition, automotive driver monitoring, 15 x 15 m DepthSense pixels surveillance & people counting, robot vision & more. Demodulation frequency up to 40 MHz The sensor features 320 x 240 (QVGA) time-of-flight Two dual channel analog outputs pixels based on DepthSense pixel technology. This < 600 raw correlation frames per second unique design allows up to 120 klux background light (typ. settings : 25 MS/s, Tint = 130 s) rejection in typical application conditions. The Typical system background light robustness sensor features high-speed analog signal outputs according to Table 1 which enable a raw frame rate of up to 600 frames Integrated optical filter per second. The sensor offers maximum (>80% transmission in range 800-900nm) compatibility with MLX75123, Melexis dedicated Ambient operating temperature ranges TOF companion chip. Combined with a modulated of -20 +85C and -40 +105C light source, a system is capable of measuring Wafer level glass BGA package distance and reflectivity at full resolution. The (Dimensions : 6.6 x 5.5 x 0.6 mm) sensor is available in automotive and industrial AEC-Q100 qualification available grades, both in a small glass BGA wafer level package form factor which offers many integration possibilities. Figure 1: MLX75023 QVGA QQVGA Modulation Illumination Frequency Mode Binning Mode LED 20 MHz > 40 klux > 120 klux Laser 20 MHz > 60 klux > 120 klux Table 1: Typical TOF system background light robustness MLX75023 Time-of-Flight Sensor Array Product Datasheet Contents Features & Benefits ................................................................................................................................... 1 Description ................................................................................................................................................ 1 1. Datasheet Change Log ........................................................................................................................... 4 2. Ordering Information ............................................................................................................................ 5 3. Application System Architecture............................................................................................................ 6 4. Pinout Description ................................................................................................................................. 7 5. Typical Connection Diagram .................................................................................................................. 8 6. Electrical Characteristics ........................................................................................................................ 9 6.1. Absolute Maximum Ratings ............................................................................................................... 9 6.2. Electrical Operating Conditions ........................................................................................................ 10 6.3. Digital IO Characteristics .................................................................................................................. 10 6.4. Dynamic Characteristics ................................................................................................................... 11 6.5. ArrayBias ........................................................................................................................................... 11 6.6. Sensor Physical Characteristics ........................................................................................................ 11 6.7. Optical & TOF Characteristics........................................................................................................... 12 7. Interface .............................................................................................................................................. 14 7.1. Timing Diagram ................................................................................................................................. 14 7.1.1. Power Up ..................................................................................................................................... 14 7.1.2. Reset ............................................................................................................................................ 14 7.1.3. Integration ................................................................................................................................... 15 7.1.4. Read-out ...................................................................................................................................... 15 7.2. Device Control ................................................................................................................................... 16 7.3. Test Column Specification ................................................................................................................ 17 7.4. Test Row Specification ...................................................................................................................... 18 8. Noise Considerations ........................................................................................................................... 19 9. Package ............................................................................................................................................... 20 9.1. Mechanical Dimensions & Cover Tape Specifications .................................................................... 20 9.2. Package Marking ............................................................................................................................... 20 9.3. Thermal Resistance ........................................................................................................................... 21 9.4. Optical Filter ...................................................................................................................................... 21 9.5. Shipping & Handling ......................................................................................................................... 22 9.6. PCB Footprint Recommendation ..................................................................................................... 23 9.7. PCB Trace Layout Recommendation ................................................................................................ 24 Version V1.18 Page 2 of 28