Product Information

MX25V4006EZNI-13G

MX25V4006EZNI-13G electronic component of Macronix

Datasheet
NOR Flash Serial 2.5V/3.3V 4M-bit 4M/2M x 1/2-bit 8ns 8-Pin WSON EP

Manufacturer: Macronix
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

74: USD 0.9302 ea
Line Total: USD 68.83

0 - Global Stock
MOQ: 74  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 74
Multiples : 1
74 : USD 0.9302

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Maximum Operating Temperature
Operating Supply Voltage
Brand
Density
Operating Supply Voltage Typ
Programmable
Interface Type
Mounting
Number Of Words
Operating Temp Range
Sync/Async
Rad Hardened
Access Time Max
Package Type
Operating Temperature Classification
Pin Count
Boot Type
Cell Type
Supply Current
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MX25V4006E MX25V4006E 2.5V, 4M-BIT x 1/x 2 CMOS SERIAL FLASH MEMORY Key Features 2.35 to 3.6 volt for read, erase, and program operations Supports HOLD feature Auto Erase and Auto Program Algorithm Low Power Consumption P/N: PM1638 REV. 1.9, June 02, 2016 1MX25V4006E Contents FEATURES ..................................................................................................................................................................4 GENERAL DESCRIPTION .........................................................................................................................................5 PIN CONFIGURATIONS ..............................................................................................................................................5 PIN DESCRIPTION ......................................................................................................................................................5 BLOCK DIAGRAM .......................................................................................................................................................6 MEMORY ORGANIZATION .........................................................................................................................................7 Table 1. Memory Organization .................................................................................................................................................7 DEVICE OPERATION ..................................................................................................................................................8 Figure 1. Serial Peripheral Interface Modes Supported ...........................................................................................................8 DATA PROTECTION ....................................................................................................................................................9 Table 2. Protected Area Sizes ..................................................................................................................................................9 HOLD FEATURE ........................................................................................................................................................10 Figure 2. Hold Condition Operation ............................................................................................................. 10 Table 3. COMMAND DEFINITION .........................................................................................................................................12 COMMAND DESCRIPTION .......................................................................................................................................13 (1) Write Enable (WREN) .......................................................................................................................................................13 (2) Write Disable (WRDI) ........................................................................................................................................................13 (3) Read Status Register (RDSR) ..........................................................................................................................................14 (4) Write Status Register (WRSR) ..........................................................................................................................................15 Table 4. Protection Modes ......................................................................................................................................................15 (5) Read Data Bytes (READ) .................................................................................................................................................16 (6) Read Data Bytes at Higher Speed (FAST READ) ...........................................................................................................16 (7) Dual Output Mode (DREAD) .............................................................................................................................................16 (8) Sector Erase (SE) .............................................................................................................................................................16 (9) Block Erase (BE) ...............................................................................................................................................................17 (10) Chip Erase (CE) ..............................................................................................................................................................17 (11) Page Program (PP) .........................................................................................................................................................17 (12) Deep Power-down (DP) ..................................................................................................................................................18 (13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) .................................................................18 (14) Read Identification (RDID) ..............................................................................................................................................19 (15) Read Electronic Manufacturer ID & Device ID (REMS) ..................................................................................................19 Table 5. ID Definitions ............................................................................................................................................................19 (16) Read SFDP Mode (RDSFDP) .........................................................................................................................................20 Read Serial Flash Discoverable Parameter (RDSFDP) Sequence ........................................................................................20 Table 6. Signature and Parameter Identification Data Values ...............................................................................................21 Table 7. Parameter Table (0): JEDEC Flash Parameter Tables .............................................................................................22 Table 8. Parameter Table (1): Macronix Flash Parameter Tables ...........................................................................................24 POWER-ON STATE ...................................................................................................................................................26 ELECTRICAL SPECIFICATIONS ..............................................................................................................................27 ABSOLUTE MAXIMUM RATINGS .........................................................................................................................................27 Figure 2. Maximum Negative Overshoot Waveform ...............................................................................................................27 CAPACITANCE TA = 25C, f = 1.0 MHz .................................................................................................................................27 Figure 3. Maximum Positive Overshoot Waveform ................................................................................................................27 Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ..................................................................................28 Figure 5. OUTPUT LOADING ...............................................................................................................................................28 Table 9. DC CHARACTERISTICS (Temperature = -40C to 85C, VCC = 2.35V - 3.6V) ....................................................29 Table 10. AC CHARACTERISTICS (Temperature = -40C to 85C, VCC = 2.35V - 3.6V) ..................................................30 Table 11. Power-Up Timing.....................................................................................................................................................31 P/N: PM1638 REV. 1.9, June 02, 2016 2

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
MACRONIX
Macronix International
MX7
MXA
MXIC(Macronix)

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