Product Information

QC-DB-P10004

QC-DB-P10004 electronic component of Lantronix

Datasheet
System-On-Modules - SOM System on Module QC 845 CPU, 4GB/32GB

Manufacturer: Lantronix
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 481.5138 ea
Line Total: USD 481.51

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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QC-DB-P10004
Lantronix

1 : USD 481.5138

     
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25mm 50mm Open-Q 845 SOM (micro System on Module) Based on the Qualcomm Snapdragon SDA845 processor Intrinsycs Open-Q 845 SOM is an ultra-compact (50mm x 25mm) production -ready SOM based on the powerful Qualcomm Snapdragon SDA845 SoC, their latest and most powerful IoT chipset. With the 3rd-Gen Qualcomm AI Platform, Spectra ISP, Kryo Octa -core CPU, Hexagon DSP, and a new dedicated secure processor, the 845 SOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices. In addition to the 845s impressive processing capabilities and on -device AI powers, it also includes new and improved I/O interfaces compared to previous Snapdragon generations four camera ports, two USB3.1 ports (including 4K60 DisplayPort + concurrent SS data), and a Gen3 PCIe interface. This powerful new hardware platform will be supported by your choice of full -featured Android or flexible Yocto Linux software. Key Features Applications Qualcomm Snapdragon SDA845 processor VR/XR platforms with 6DoF and SLAM Built on 2nd-Gen 10nm LPP technology Robotics and Drone products 4GB or 6GB LPDDR4X + 32GB or 64GB UFS Premium camera platforms with cinema -grade video 4 MIPI CSI camera ports On-device artificial intelligence & machine learning Vault-like security features built-in Advanced graphics and 3D gaming 802.11ac 2x2 MU-MIMO Wi-Fi / BT 5.x Multi -camera systems Ultra-compact 50mm x 25mm Machine vision platforms Datasheet: Open-Q 845 SOM v1.0 Copyright 2019 Intrinsyc Technologies Corporaoti n www.intrinsyc.com Hardware Specificaonsti Processors Qualcomm Snapdragon SDA845 built on 2nd-Gen 10nm technology: Qualcomm Kryo 385 CPU: 4 Kryo Gold 2.649GHz cores + 4 Kryo Silver low-power 1.766GHz cores Qualcomm Hexagon 685 DSP with Hexagon Vector eXtensions (dual-HVX512) Qualcomm Adreno 630 GPU with OpenGL RD 3.2 + AEP, DX next, Vulkan 2, OpenCL 2.0 full profile Memory/Storage 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz + 32GB or 64GB UFS Flash Storage Wireless Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2x2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector Bluetooth 5.x Display Interfaces 2x 4-lane MIPI DSI D-PHY 1.2, up to 3840 2400 10-bit 60 fps VESA DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency Camera Interfaces 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI Qualcomm Spectra 280 ISP: 16 +16 + 2 MP sensor resolution 32MP 30fps ZSL with dual ISP 16 MP 30 ZSL with a single ISP Video Performance Encode: 4K60 for H.264/H.265, 4K30 for VP8 Decode: 4K60 H.264/H.265/VP9 Support for HDR 10-bit capture (HLG) Support for HDR 10-bit video playback (HLG, HDR10) Audio Interfaces Dedicated audio DSP integrated with support for external WCD9340 codec and WSA8810/WSA8815 speaker amps 1x SLIMBus interface for external Qualcomm Codecs 1x 4-lane MI2S interface + 2x 2-lane MI2S interfaces (muxed with SLIMBus) for other external audio devices I/O Interfaces 2 USB ports: 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB data concurrency, 1x USB 3.1 1x PCIe Gen3 1-lane, 4-bit SD 3.0, UART, I2C, SPI, configurable GPIOs Sensor Core Interface SPI, I2C, GPIO connections to sensor core DSP Power/Battery Power management and battery charging solution on SOM Management Qualcomm PM845 + PM8998 + PM8005 Operating Input voltage: 3.5V to 4.7V Environment Operating Temperature: -25C to +85C Tc (based on component case temperature specifications) Form Factor 50mm x 25mm with 3x 100 pin board to board connectors Software OS Support Android 9 Pie based on kernel v4.9, Linux OS based on Yocto Rocko, kernel v4.9 Note that all hardware features may not be supported by all SW see latest SW release notes for details. Purchasing Information Part number: QC-DB-P10004 Open-Q 845 SOM 4GB DDR + 32GB UFS Part number: QC-DB-P10004B Open-Q 845 SOM 6GB DDR + 64GB UFS Alternate SOM configurations available by special order (minimum order quantieti s apply) - e.g. different memory size, etc. Contact sales to discuss your specific needs today: sales intrinsyc.com Planned Cercatitifi ons Specificaoti ns are subject to change without nocti e. Not all features listed may be supported in software. All brand or prod uct names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission. Cortex is a trademark of ARM Holding plc. Used with permission. Intrinsyc Technologies Corp. : 885 Dunsmuir Street : Third Floor: Vancouver : Canada : V6C 1N5 : +1 (604) 801-6461 : sales intrinsyc.com Datasheet: Open-Q 845 SOM v1.0 Copyright 2019 Intrinsyc Technologies Corporaoti n

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
Lantronix
Lantronix, Inc.
Maestro
Maestro Wireless Solutions

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