Product Information

HX324C11SRK4/32

HX324C11SRK4/32 electronic component of Kingston

Datasheet
DRAM Module DDR3 SDRAM 32Gbyte 240DIMM
Manufacturer: Kingston
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 524.3868 ea
Line Total: USD 524.39

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

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0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 1
Multiples : 1
1 : USD 524.3868

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Additional Infomation About Product

HX324C11SRK4/32 32GB (8GB 1G x 64-Bit x 4 pcs.) DDR3-2400 CL11 240-Pin DIMM SPECIFICATIONS CL(IDD) 11 cycles Row Cycle Time (tRCmin) 48.125ns(min.) 260ns(min.) Refresh to Active/Refresh Command Time (tRFCmin) Row Active Time (tRASmin) 35ns(min.) Maximum Operating Power TBD W* UL Rating 94 V - 0 o o Operating Temperature 0 C to +85 C o o Storage Temperature -55 C to +100 C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX324C11SRK4/32 is a kit of four 1G x 64-bit (8GB) JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply DDR3-2400 CL11 SDRAM (Synchronous DRAM) 2Rx8, VDDQ = 1.5V (1.425V ~ 1.575V) memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel 800MHz fCK for 1600Mb/sec/pin XMP (Extreme Memory Profiles). Total kit capacity is 32GB. 8 independent internal banks Each module has been tested to run at DDR3-2400 at a low latency timing of 11-13-14 at 1.65V. The SPDs are Programmable CAS latency: 11, 10, 9, 8, 7, 6 programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold Programmable Additive Latency: 0, CL - 2, or CL - 1 clock contact fingers. The JEDEC standard electrical and 8-bit pre-fetch mechanical specifications are as follows: Burst Length: 8 (interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not XMP TIMING PARAMETERS allow seamless read or write (either on the fly using A12 or MRS) JEDEC: DDR3-1600 CL11-11-11 1.5V XMP Profile 1: DDR3-2400 CL11-13-14 1.65V Bi-directional Differential Data Strobe XMP Profile 2: DDR3-2133 CL11-13-13 1.6V Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C Asynchronous Reset Height 1.311 (33.30mm), w/heatsink, double sided component Continued >> kingston.com/hyperx Document No. 4807133-001.B00 04/22/15 Page 1continued HyperX MODULE WITH HEAT SPREADER 7.9 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No. 4807133-001.B00 Page 2 33.3 mm

HS Compliance

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:

Kingston may also be referenced as

KINGSTON CARTON COMPANY LTD
Kingston Technology
KINGSTON TECHNOLOGY COMPANY
KNG

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