Product Information

HF225U-0.0015-00-11/500

HF225U-0.0015-00-11/500 electronic component of Henkel

Datasheet
Thermal Interface Products Non-Reinforced Phase Change Thermal Interface Material, 0.0015" Thickness, 11 Inch x 500 Foot Roll, Hi-Flow THF 1000U Series / Also Known as Bergquist Hi-Flow 225U Series

Manufacturer: Henkel
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 17424.6319 ea
Line Total: USD 17424.63

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 15049.1676
10 : USD 14320.5672
50 : USD 13759.4191
100 : USD 13061.1795
500 : USD 12611.3579
1000 : USD 12592.2477
2000 : USD 12592.2477
5000 : USD 12592.2477
10000 : USD 12592.2477

     
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Thermal Interface Products
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Technical Data Sheet BERGQUIST HIFLOW THF 1000U Known as BERGQUIST HI-FLOW 225U April -2020 PRODUCT DESCRIPTION 100 psi 0.34 Non-Reinforced Phase Change Thermal Interface Material . 200 psi 0.32 2 (2) Thermal Impedance ,ASTM D5470,C-in /W : Technology Phase Change 10 psi 0.08 Appearance Black 25psi 0.07 Reinforcement Carrier None 50psi 0.06 Total Thickness 0.036mm 100 psi 0.05 ,ASTM D374 200 psi 0.04 Application Thermal management, Thermally conductive adhesive 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one Operating Temperature 150C conducting layer in a three- layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin filmproducts is highly dependent upon FEATURES AND BENEFITS the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. 2 Thermal impedance: 0.07C-in /W 25 psi Please contact Bergquist Product Management ifadditional specifications are required. 2)The ASTM D5470test fixture was used and the test sample was conditioned at 70C prior Hi-Flow coating will resist dripping to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, Thermally conductive 55Cphase change compound flatness and pressure applied. Available in roll form with kiss-cut parts TYPICAL APPLICATIONS GENERAL INFORMATION For safe handling information on this product, consult the Safety Computer and peripherals Data Sheet, (SDS). High performance computer processors Graphic cards Not for product specifications Power modules The technical data contained herein are intended as reference only. Please contact your local quality department for BERGQUIST HIFLOW THF 1000U is designed for use as a assistance and recommendations on specifications for this thermal interface material between a computer processor and product. a heat sink . The product consists of a thermally conductive 55Cphase change compound coated on a release liner and APPLICATION METHODS supplied on a carrier . 1. Hand-apply to 35- 45C heat sink. The heat sink is heated in an oven or via heat gun to between 35- 45C.The Above its phase change temperature, BERGQUIST HIFLOW BERGQUIST HIFLOW THF 1000U part is then applied like THF 1000U wets-out the thermal interface surfaces and flows an adhesive pad. The heat sink is cooled to room temperature to produce the lowest thermal impedance . The material and packaged. Aprotective tab liner remains in place until the requires pressure of the assembly to cause flow . unit is ready for final assembly. The protective tab can be readily removed from the applied BERGQUIST HIFLOW THF TYPICAL PROPERTIES 1000U pad at a maximum temperature of 28. Physical Properties 2. Automated equipment with 30-psi pressure. A pick-and- Phase Change Temperature ,ASTM D3418 ,C 55 place automated dispensing unit can be used to apply the Flammability Rating, UL 94 V-0 BERGQUIST HI FLOW THF 1000U pad to a room-temperature heat sink. The placement head should Thermal Properties have a silicone rubber pad, and should apply approximately (1) Thermal Conductivity ,ASTM D5470,W/(m-K) 1.0 30 psi pressure to the pad on transfer to the 25 35C heat sink. Once applied, the protective tab can be readily removed Thermal Performance vs. Pressure from the BERGQUIST HI FLOW THF 1000U pad at a TO-220 Thermal Performance ,C/W : maximum temperature of 28C. 10 psi 0.53 25psi 0.47 50psi 0.39TDS BERGQUIST HIFLOW THF 1000U , April -2020 Trademark usage CONFIGURATIONS AVAILABLE Except as otherwise noted, all trademarks in this document are trademarks of BERGQUIST HIFLOW THF 1000U are supplied in: Henkel Corporation in the U.S. and elsewhere. denotes a trademark registered in the U.S. Patent and Trademark Office. Roll form with tabs, kiss-cut parts no holes BERGQUIST HIFLOW THF 1000U is limited to a square Reference 2 or rectangular part design. Dimensional tolerance is +/- 0.020inch (0.5mm) Conversions (C x 1.8)+ 32 =F kV/mm x 25.4=V/mil mm /25.4=inches N x 0.225=lb/F N/mm x 5.71=lb/in psi x 145=N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142=ozin mPas =cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legal ground, Henkels liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
BERGQUIST
Bergquist Company
Henkel
Loctite
LOCTITE AMERICAS
Multicore
MULTICORE (SOLDER)
MULTICORE / LOCTITE

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