TechnicalData Sheet LOCTITE GC 3W January -2016 PRODUCT DESCRIPTION Solder Alloy ( J-STD 006) LOCTITE GC 3W provides the followingproduct characteristics: LOCTITE Code SAC305 Henkel Former Description 97SC Technology Solder paste Melting Point (C) 217 Application Pb-free soldering,Halogen-free,Water washable flux Solder Paste Typical Properties Based on T3 powder LOCTITE GC 3W isa halogen free,water- washable, Pb-free solder Metal Content, % 89.5 paste specially formulated to provide excellent humidity resistance. Brookfield Viscosity 25C, mPa.s 595,000 LOCTITE GC 3W shows excellent solderability when reflowed inboth Spindle TF,Speed 5 rpm, 2 minutes air and nitrogen across a wide range of challengingsurface finishes Malcom Viscosity 25 C ,Pa.s 150 includingOSP-Cu ,ENIG and Silver. Speed 10 rpm Thixotropic Index (Ti) 0.45 FEATURES AND BENEFITS -1 Ti= log (1.8/18s ) Water washable, Pb-free solder paste Useful stencillife,hours >24 Halogen-freeflux: passes ICwith pretreatment IPC-TM-650 IPC Slump ,mm 2.3.34/EN14582 25C, 15 minutes Halogen-freeflux classification: ORM0 to ANSI/J-STD-004 Rev. 0.33x 2.0 mm pads 0.2 Formulated so residues can be cleaned with deionized water 0.63x 2.0mm pads 0.33 Humidity resistance:excellent coalescenceafter 24 hours IPC Slump ,mm exposure to 27C/ 80% RH 182C, 15 minutes 0.33x 2.0 mm pads 0.2 Excellent resistanceto solder balling,initiallyand after exposure 0.63x 2.0mm pads 0.33 to humidity -1 Suitable for finepitch, highspeed printingup to 150 mms Based on T4 powder (6 /s) Metal Content, % 89.5 Excellent paste transfer efficiencyafter extended abandon times Brookfield Viscosity 25 C ,Pa-s 784,000 Excellent paste transfer efficiencyafter extended printingtime Spindle TF,speed 5 rpm ,after 2 minutes Humidity Resistance:Enhanced tack time Malcom Viscosity 25 C ,Pa.s 180 Suitable for singleand double side reflow Speed 10 rpm Thixotropic Index (Ti) 0.48 -1 TYPICAL PROPERTIES Ti= log (1.8/18s ) Solder Powder Useful stencillife,hours >24 Careful control of the atomisation process for production of solder IPC Slump ,mm powders for LOCTITE GC 3W solder pastes ensures that the solder 25 C, 15 minutes powder isproduced to a quality level that exceeds J-STD-006, EN 0.33x 2.0 mm pads 0.2 29453 requirements for sphericity, size distribution, impurities and 0.63x 2.0 mm pads 0.33 oxide levels. IPC Slump ,mm 182 C, 15 minutes Minimum order requirements may apply to certain alloys and powder 0.33x 2.03 mm pads 0.2 sizes,for availability contact your localtechnicalservice helpdesk. 0.63x 2.03 mm pads 0.33 Allsolder powders are RoHS compliant. DIRECTIONS FOR USE Particle Size Distribution (PSD) (J-STD- 005A ) Printing: Type 3 Powder -1 Printing at speeds up to 150 mm.s (6/s) can be achieved using Powder Description T3 typical stencilsand metal squeegees . Powder Particle Size Distribution 25 to 45 m Sufficient pressure should be applied to achieve a cleanwipe of Henkel Former Description AGS the stenciltopside surface . Under laboratory conditions acceptable print quality on 0.5 mm Type 4 Powder balldevices and 0.4mm QFP patterns has been achieved after Powder Description T4 printer down times of 4 hours without requiring a knead cycle . Powder Particle Size Distribution 20 to 38 m Henkel Former Description DAPTDS LOCTITE GC 3W , January -2016 Reflow: Shelf Life: Reflow has been assessed using a typical convection reflow Provided LOCTITE GC 3W is stored tighly sealedinthe original oven . container at 0 to 25 C 1.5C (32 to 77F 1.5F) ,a minimum shelf lifeof 180 days can be expected. Optimal aerobic reflow can be achieved by ramping to a peak temperature of 225 to 250 C at 0.8 to 1.5C/ second and with a soak above the reflow temperature (217C) for 20 to 50 seconds . Example profilesthat have shown good performance- for reflow and subsequent cleaning-are presented below. Reflow soldering DATA RANGES can alsobe carried out ina nitrogen atmosphere . The data contained hereinmay be reported as a typical value and/or a range. Values are based on actual test data and are verified on a periodic basis. GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Not for Product Specifications The technical information contained herein isintended for reference only. Please contact Henkel Technologies Technical Service for assistanceand recommendations on specificationsfor this product. Conversions (C x 1.8)+ 32 = F kV/mm x 25.4 = V/mil mm /25.4 = inches Cleaning: m /25.4 = mil The post-soldering residues of LOCTITE GC 3W solder paste Nx 0.225 = lb must be removed by cleaning. N/mmx 5.71 = lb/in Cleaningcan be performed using spray in air,spray under N/mm x 145 = psi immersion or ultrasonic cleaningmethods . MPa x 145 = psi The post-soldering residues are designed to be removed from Nm x 8.851= lbin assembliesinan aqueous cleanerwithout the use of rinseaids Nm x 0.738= lbft and/or saponifiers,typically using water at 40 to 60C with Nmm x 0.142= ozin deionized water for the finalrinse. mPas = cP Disclaimer RELIABILITYPROPERTIES Note: Flux Properties: The information provided in this TechnicalData Sheet (TDS) including the LOCTITE GC 3W contains a stable water- washable resinsystem and recommendations for use and application of the product are based on our slow evaporating solvents knowledge and experience of the product as at the date of this TDS.The product can have a variety of different applications as well as differingapplication and Test Specification Results working conditions inyour environment that are beyond our control. Henkelis, therefore, not liablefor the suitability of our product for the production processes Flux Corrosion J-STD004B (2.6.15C) Pass and conditions in respect of which you use them, as well as the intended Copper Mirror J-STD004B (2.3.32D) Pass applications and results. We strongly recommend that you carry out your own (cleaned) prior trialsto confirmsuch suitability of our product. Surface Insulation J-STD004B (2.6.3.7) Pass Any liabilityinrespect of the information inthe TechnicalData Sheet or any other written or oral recommendation(s) regardingthe concerned product isexcluded, Resistance (SIR) (cleaned) except ifotherwise explicitly agreed and except inrelation to death or personal J-STD004B (2.6.3.3) Pass injury caused by our negligenceand any liabilityunder any applicablemandatory (cleaned) product liabilitylaw. Electromigration (ECM) J-STD004B (2.6.14.1) Pass In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Flux Activity Classification J-STD004B ORM0 Henkel France SA please additionally note the following: Incase Henkel would be nevertheless held liable,on whatever legalground, PACKAGING Henkelsliabilitywillinno event exceed the amount of the concerned delivery. LOCTITE GC 3W isavailablein500 gram jars and 600 grams Semco In case products are delivered by Henkel Colombiana, S.A.S.the following cartridge . disclaimer is applicable: The information provided in this TechnicalData Sheet (TDS) including the Storage: recommendations for use and application of the product are based on our Optimal storage: 0 to 25 C 1.5C (32 to 77F 1.5F) knowledge and experience of the product as at the date of this TDS. Henkelis, therefore, not liablefor the suitability of our product for the production processes Storage information may be indicated on the product container and conditions in respect of which you use them, as well as the intended labelling.Material removed from containers may be contaminated applications and results. We strongly recommend that you carry out your own during use. Do not return products to the originalcontainer. Henkel prior trialsto confirmsuch suitability of our product. Corporation cannot assume responsibility for product that has been Any liabilityinrespect of the information inthe TechnicalData Sheet or any other contaminated or stored under conditions other than those previously written or oral recommendation(s) regardingthe concerned product isexcluded, indicated. Ifadditional information isrequired, please contact your except ifotherwise explicitly agreed and except inrelation to death or personal localTechnicalService Center or Customer Service Representative. injury caused by our negligenceand any liabilityunder any applicablemandatory product liabilitylaw. Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics