GS-300 300 Tie-Point, Solderless Breadboard Applications The GS-300 is a Features modular type solderless breadboard that connects z 300 Tie-points with the GS-050 bus z ABS plastic body strip to make a 400 tie point breadboard (GS- z Square hole style 400). Expandable in two z Interlocking tabs dimensions, it is a great z Peel and stick adhesive way to prototype low frequency or DC powered z Nickel plated phosphor bronze spring clip circuits. They are ideal contacts for: z Allowable wire diameter of 0.4-0.7 mm z Educational labs z Fits 3 total 16-pin ICs z Measures 3.7 x 8.6 x 1.0 cm z Hobbyists z Weighs 22 g z Maximum capacity of 1.5 A at 36 V z RoHS compliant z Three-year warranty 22820 Savi Ranch Parkway Yorba Linda, CA 92887 800-572-1028 globalspecialties.com A Cal Test Electronics Company 20180118GS-300 300 Tie-Point, Solderless Breadboard Applications The GS-300 is a modular type solderless breadboard that connects with the GS-050 bus strip to make a 400 tie point breadboard (GS- 400). Expandable in two dimensions, it is a great way to prototype low frequency or DC powered circuits. They are ideal for: z Educational labs z Hobbyists 22820 Savi Ranch Parkway Yorba Linda, CA 92887 800-572-1028 20180118 globalspecialties.com A Cal Test Electronics Company