Product Information

PKF4918BSI

PKF4918BSI electronic component of Flex

Datasheet
PKF MACRODENSTM SERIES, ISOLATED, SURFACE MOUNT, CONVERTER
Manufacturer: Flex
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 18.2669 ea
Line Total: USD 18.27

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

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0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1
Multiples : 1
1 : USD 18.2669

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Additional Infomation About Product

PKF series PKF series General information SMD and through hole versions with ultra-low component height 8.0 mm (0.315 in.)  Up to 87% efficiency at full load  Safety requirements in accordance with EN60950  MTTF >10 million hours at +50C case temperature (+40C ambient)  Low EMI Patents US: D357901 DE: M94022763 The MacroDens PKF family of true component with present and future application needs, including level on-board DC/DC power modules are intended non temperature controlled environments. The as distributed power sources in decentralized power mechanical design offers surface mount and through- systems. Utilization of thick film technology and a hole versions, delivered in ready-to-use tubes, trays or high degree of silicon integration has made it possible tape & reel packages, and compatibility with semi and to achieve a MTTF of more than 10 million hours. fully aqueous cleaning processes. The PKF series is The high reliability and the very low heights of these manufactured in highly automated production lines DC/DC power modules makes them particularly using SMT, laser trimming, 100% burn-in and ATE suited for Information Technology and Telecom final inspection. (IT&T) applications, with board spacing down to Ericsson Microelectronics AB has been an ISO 9001 15 mm or 0.6 in. They are optimized for an certified supplier since 1991. For a complete product operational ambient temperature range in compliance program please reference the back cover. Environmental Characteristics Characteristics Test procedure & conditions Frequency 10500 Hz Vibration JESD 22-B103 Amplitude 0.75 mm (Sinusoidal) (IEC 68-2-6 F c) Acceleration 10 g Number of cycles 10 in each axis Frequency 10500 Hz Acceleration density Random MIL-STD-883 2 spectrum 0.5 g /Hz vibration Method 2026 Duration 10 min in 3 directions (IEC 68-2-34 E d) Reproducability medium (IEC 62-36) Shock JESD 22-A104 Peak acceleration 200 g (Half sinus) Shock duration 3 ms (IEC 68-2-14 N a) JESD 22-A101 Temperature 85C Temperature (IEC 68-2-3 C Humidity 85% RH a change with bias) Duration 1000 hours Accelerated JESD 22-B104 Temperature 40C+125C damp heat (IEC 68-2-27 E Number of cycles a) 500 Aggressive Duration 96 h JESD 22-A-A107 35C environment Temperature (IEC 68-2-11 K ) a JESD 22-B106 Temperature, solder Resistance to 260C 1) 2) (IEC 68-2-20 T 1A) Duration 10...13 s soldering temp b High temp Temperature 125C JESD22-A10 Duration Storage life 1000hrs Lead Integrity JESD22-B105 Number of cycles 2 JESD22-B102 Solderability Temperature 85C Maximum load Operational Input voltage on 9min life test Input voltage off 3min Duration 1000hrs Moisture reflow J-STD-020 Level 1 Senitive classification 1) Applies to through-hole versions 2) For surfacemount versions please see soldering profile page 4. 2 EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001

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