Product Specification Shwo 1W Series Shwo Shuo is the English translation for the Chinese word meaning Twinkle and is often used as a description of stars or other bright, celestial objects as seen from Earth. This word is a relevant description for this bright, compact Everlight LED package. Introduction The Shwo series is a surface-mount high-power device featuring high brightness combined with a compact size that is suitable for all kinds of lighting applications such as general illumination, flash, spot, signal, industrial and commercial lighting. The thermal pad of this device is electrically isolated providing convenience in thermal and electrical design. The Shwo series is one of the most promising devices in Everlights high power product offering and is ready to face the challenges of todays Solid-State Lighting requirements. Features Applications General Lighting Small package with high efficiency Decorative and Entertainment ESD protection up to 8KV Lighting Soldering method: SMT Signal and Symbol Luminaries Binning Parameters: Brightness, Exterior and Interior Automotive Forward Voltage ,Wavelength and Illumination Chromaticity Moisture Sensitivity Level: 1 RoHS compliant Matches ANSI binning Reliability testing conforms to IESNA LM80 Lumen maintenance test method 1 Table of Contents Product Nomenclature ..................................................................................................... 3 Absolute Maximum Ratings ............................................................................................. 4 JEDEC Moisture Sensitivity ............................................................................................. 4 Luminous Flux Characteristics for the Shwo series.......................................................... 5 PN of the Shwo series: White LEDs................................................................................. 6 PN of the Shwo series: Color LEDs ................................................................................. 7 Product Binning................................................................................................................ 8 White Bin Structure .......................................................................................................... 9 Forward Voltage Bins ..................................................................................................... 13 Color Bins ...................................................................................................................... 14 Optical Characteristics ................................................................................................... 15 Mechanical Dimension................................................................................................... 16 Pad Configuration .......................................................................................................... 17 Reflow Soldering Characteristics ................................................................................... 18 Wavelength Characteristics............................................................................................ 19 Typical Light Output Characteristic vs. Thermal Pad Temperature................................. 21 Typical Electrical Characteristics.................................................................................... 22 Typical Relative Luminous Flux vs. Forward Current ..................................................... 23 Typical Wavelength & CCT Shift Characteristics vs.Forward Current ............................ 25 Current Derating Curves ................................................................................................ 27 Typical Radiation Patterns ............................................................................................. 28 Emitter Tape Packaging ................................................................................................. 30 Emitter Reel Packaging.................................................................................................. 31 Product Labeling ............................................................................................................ 31 Revision History ............................................................................................................. 32 2