CCCCrrrryyyyssssttttaaaallll oooosssscccciiiillllllllaaaattttoooorrrr CRYSTAL OSCILLATOR (Programmable) OUTPUT: CMOS Product Number (please contact us) SG-8101CA: X1G00519xxxxx00 SG-8101CB: X1G00520xxxxx00 SG 8101series SG-8101CE: X1G00521xxxxx00 Frequency range : 0.67 MHz ~ 170 MHz (1 ppm Step) SG-8101CG: X1G00518xxxxx00 Supply voltage : 1.62 V ~ 3.63 V Function : Output enable (OE) or Standby (ST ) Frequency tolerance, operating temperature: 15 ppm (-40 C ~ +85 C) 20 ppm, 50 ppm (-40 C ~ +105 C) Package 2.5 x 2.0, 3.2 x 2.5, 5.0 x 3.2, 7.0 x 5.0 (mm) PLL technology to enable short lead time CG CE CB CA Available field oscillator programmer SG-Writer II Specifications (characteristics) Item Symbol Specifications Conditions/Remarks 1.80 V Typ. 2.50 V Typ. 3.30 V Typ. V - Supply voltage CC 1.62 V ~ 1.98 V 1.98 V ~ 2.20 V 2.20 V ~ 2.80 V 2.70 V ~ 3.63 V f 0.67 MHz ~ 170 MHz Output frequency range O Storage temperature T stg -40 C ~ +125 C Storage as single product. -40 C ~ +85 C - Operating temperature T use -40 C ~ +105 C - -6 B: 15 10 T use = -40 C ~ +85 C *1 -6 Frequency tolerance f tol C: 20 10 T use = -40 C ~ +105 C -6 J: 50 10 T use = -40 C ~ +105 C 3.2 mA Max. 3.3 mA Max. 3.4 mA Max. 3.5 mA Max. T use = +105 C No load, f = 20 MHz O 2.7 mA Typ. 2.9 mA Typ. 3.0 mA Typ. T use = +25 C Current consumption I CC 5.5 mA Max. 5.8 mA Max. 6.7 mA Max. 8.1 mA Max. T use = +105 C No load, f = 170 MHz O 4.7 mA Typ. 5.7 mA Typ. 6.8 mA Typ. T use = +25 C Output disable current I dis 3.2 mA Max. 3.2 mA Max. 3.3 mA Max. 3.5 mA Max. OE = GND, f = 170 MHz O 0.9 A Max. 1.0 A Max. 1.5 A Max. 2.5 A Max. T use = +105 C Standby current I std S T = GND 0.3 A Typ. 0.4 A Typ. 0.5 A Typ. 1.1 A Typ. T use = +25 C Symmetry SYM 45 % ~ 55 % 50 % V Level CC I /I Conditions mA OH OL Rise/Fall time V *A *B *C *D CC V 90 % V Min. OH CC I -2.5 -3.5 -4.0 -5.0 Default (f > 40 MHz), OH O Fast I 2.5 3.5 4.0 5.0 OL Output voltage I -1.5 -2.0 -2.5 -3.0 OH Default (f 40 MHz) O (DC characteristics) I 1.5 2.0 2.5 3.0 OL I -1.0 -1.5 -2.0 -2.5 OH Slow V 10 % V Max. I 1.0 1.5 2.0 2.5 OL CC OL *A: 1.62 V ~ 1.98 V, *B: 1.98 V ~ 2.20 V, *C: 2.20 V ~ 2.80 V, *D: 2.70 V ~ 3.63 V L CMOS Output load condition 15 pF Max. - V 70 % V Min. IH CC OE or S T Input voltage V 30 % V Max. IL CC 3.0 ns Max. f > 40 MHz O Default 6.0 ns Max. f 40 MHz O Rise and Fall 20 % - 80 % V CC, tr/tf time L CMOS = 15 pF Fast 3.0 ns Max. f = 0.67 MHz ~ 170 MHz O Slow 10.0 ns Max. f = 0.67 MHz ~ 20 MHz O Measured from the time OE or S T pin crosses 30 % Disable Time t stp 1 s Max. V CC t sta 1 s Max. Measured from the time OE pin crosses 70 % V Enable Time CC Resume Time t res 3 ms Max. Measured from the time S T pin crosses 70 % V CC Measured from the time V reaches its rated CC Start-up time t str 3 ms Max. minimum value, 1.62 V Frequency aging f aging This is included in frequency tolerance specification. +25 C, first year *1 Frequency tolerance includes initial frequency tolerance, temperature variation, supply voltage variation, reflow drift, load drift and aging (+25 C, 1 year). Pin description Pin Name I/O type Function High: Specified frequency output from OUT pin OE Input Output enable Low: Out pin is low (weak pull down), only output driver is disabled. 1 High: Specified frequency output from OUT pin S T Input Standby Low: Out pin is low (weak pull down), Device goes to standby mode. Supply current reduces to the least as I std. 2 GND Power Ground 3 OUT Output Clock output 4 V Power Power supply CC CCCCrrrryyyyssssttttaaaallll oooosssscccciiiillllllllaaaattttoooorrrr Product Name SG-8101CG 170.000000MHz T C H P A Available combination CG: 2.5 mm x 2.0 mm B: C: J: B: C: J: B: C: J: B: C: J: -6 -6 -6 -6 -6 -6 -6 -6 -6 -6 -6 -6 15 x 10 20 x 10 50 x 10 15 x 10 20 x 10 50 x 10 15 x 10 20 x 10 50 x 10 15 x 10 20 x 10 50 x 10 G: -40 C ~ +85 C H: -40 C ~ +105 C External dimensions (Unit: mm) Footprint (Recommended) (Unit: mm) SG-8101CG SG-8101CG SG-8101CE SG-8101CE SG-8101CB SG-8101CB SG-8101CA SG-8101CA Notes: In order to achieve optimum jitter performance, the 0.1 F capacitor between V and GND should be placed. It is also CC recommended that the capacitors are placed on the device side of the PCB, as close to the device as possible and connected together with short wiring pattern.