SCTP310ML

Page 1 PROVISIONAL TDS SCTP Surface-Cure Thermal Paste SCTP is a specially designed thermal interface material and is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity of heat dissipation is important. SCTP is specifically designed to resist pumping out of the thermal interface material from the bond line and can be applied using industrial dispensing equipment or via screen/stencil printing onto the contact surfaces. Pump-out resistant and high thermal stability ideal for applications with rapid temperature cycling Solvent-free, efficient application can be applied by screen/stencil print or dispensing equipment Good thermal conductivity and low thermal resistance designed for use at the thermal interface Non-setting allows simple/efficient rework of components and minimises effects of CTE mismatch Approvals: RoHS-2 Compliant (2011/65/EU): Yes Typical Properties: Colour: White Base Silicone Oil Thermo-conductive Component: Powdered metal oxides Density 20C (g/ml): 2.6 Viscosity (Pas) 100-150 Thermal Conductivity (Guarded Hot Plate): 1.20 W/mK (calculated) Thermal Conductivity (Heat Flow): 0.80 W/mK Temperature Range: -50C to +200C Weight Loss after 96 hours 100C: <0.8% Permittivity 1 MHz: 4.9 12 Volume Resistivity: 1 x 10 Ohms-cm Dielectric Strength: 12 kV/mm Flame Retardancy: Meets UL94 V-0 Description Packaging Order Code Shelf Life Surface-Cure Thermal Paste 310ml Syringe SCTP310ML 6 months Page 2 Directions for Use Thermal interface materials can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of compound is required to fill these spaces and thus dramatically increase the effective surface area for heat transfer. It is important to note that the quality of application of a thermal paste can be as important as the thermal conductivity of the material applied best results are achieved when a uniform, thin coat is applied between the mating surfaces. Apply a thin layer of compound to one of the contact surfaces using a brush, spatula, roller, automated system or screen printing technique. Ensure that the entire interface is covered to avoid hot-spots from forming. Any excess paste squeezed out during the mounting process should be removed. Test Information A test method was created to illustrate the effects of pump-out during thermal cycling. The below pictures show the application of SCTP, a non-silicone paste and a silicone paste between a sheet of aluminium and a glass plate. The samples were subjected to a thermal shock programme -40 to +125C for 100 cycles. It is evident that SCTP has far superior resistance to thermal cycling and the effects of pump-out when compared to standard silicone and non-silicone thermal pastes. Thus, with such minimal change during environmental testing SCTP can help to greatly reduce thermal resistance at the interface over the lifetime of the device. SCTP Non-Silicone Paste Silicone Paste