Product Information

5962-9325301BCA(NSC)

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See Product Specifications

Buffer/Line Driver 4-CH Non-Inverting 3-ST CMOS 14-Pin CDIP

Manufacturer: E2v

This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 224.1171 ea
Line Total: USD 224.12

0 - Global Stock

MOQ: 1 Multiples: 1
Pack Size: 1

More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 - Warehouse 1 Ships to you between Mon. 06 May to Fri. 10 May MOQ : 1 Multiples : 1 5962-9325301BCA(NSC) E2v	1 : USD 224.1171 10 : USD 191.2514 50 : USD 181.1821 100 : USD 172.1241 250 : USD 114.7531

Read More Specifications

Manufacturer E2v E2v
Product Category Unclassified Unclassified
Hts 8542.31.00.01 8542.31.00.01
Logic Family Ac Ac
Logic Function Buffer/Line Driver Buffer/Line Driver
Number Of Elements Per Chip 4 4
Number Of Channels Per Chip 4 4
Number Of Inputs Per Chip 4 4
Number Of Input Enables Per Chip 0 0
Number Of Outputs Per Chip 4 4
Number Of Output Enables Per Chip 4 Low 4 Low
Bus Hold No No
Polarity Non-Inverting Non-Inverting
Maximum Propagation Delay Time @ Maximum Cl Ns 9@3V\|7@4.5V 9@3V\|7@4.5V
Absolute Propagation Delay Time Ns 11 11
Process Technology Cmos Cmos
Input Signal Type Single-Ended Single-Ended
Output Type 3-State 3-State
Maximum Low Level Output Current Ma 24 24
Maximum High Level Output Current Ma - 24 - 24
Minimum Operating Supply Voltage V 3 3
Typical Operating Supply Voltage V 5\|3.3 5\|3.3
Maximum Operating Supply Voltage V 5.5 5.5
Maximum Quiescent Current Ua 15 15
Propagation Delay Test Condition Pf 50 50
Minimum Operating Temperature °C - 55 - 55
Maximum Operating Temperature °C 125 125
Supplier Temperature Grade military military
Standard Package Name Dip Dip
Pin Count 14 14
Supplier Package Cdip Cdip
Mounting Through Hole Through Hole
Package Height 4.57(Max) 4.57(Max)
Package Length 19.94(Max) 19.94(Max)
Package Width 7.87(Max) 7.87(Max)
Pcb Changed 14 14
Lead Shape Through Hole Through Hole

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